Hostname: page-component-78c5997874-mlc7c Total loading time: 0 Render date: 2024-11-10T18:57:26.739Z Has data issue: false hasContentIssue false

Synthesis and Electronic Application of Germanium Nanocrystals in Silicon Oxide Matrix

Published online by Cambridge University Press:  01 February 2011

Wee Kiong Choi
Affiliation:
[email protected], National University of Singapore, Electrical and Computer Engineering, 4 Engineering Drive 3, Singapore, 117576, Singapore, 65-65166473, 65-6779103
Wai Kin Chim
Affiliation:
[email protected], National University of Singapore, Electrical and Computer Engineering, 4 Engineering Drive 3, Singapore, 117576, Singapore
Han Guan Chew
Affiliation:
[email protected], National University of Singapore, Singapore-MIT Alliance, 4 Engineering Drive 3, Singapore, 117576, Singapore
Get access

Abstract

The size of germanium (Ge) nanocrystals in a trilayer memory device structure was controlled by varying the thickness of the middle co-sputtered Ge plus silicon oxide layer. Such confinement of nanocrystals was not effective in a trilayer structure with a pure Ge middle layer. Significant diffusion of Ge atoms through the tunnel oxide or rapid thermal oxide (RTO) layer and into the silicon substrate was observed when the RTO layer thickness of the trilayer structure was reduced. This resulted in no (or very few) nanocrystals formed in the system. A higher charge storage capability was obtained from devices with a thinner RTO layer.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Tiwari, S., Rana, F., Hanafi, H., Hartstein, A., Crabbé, E.F., Chan, K., Appl. Phys. Lett., 68, 1377, 1996.Google Scholar
2. Kim, I., Han, S., Kim, H., Lee, J., Choi, B., Hwang, S., Ahn, D., Shin, H., Tech. Dig. – Int. Electron. Devices Meet., 111, 1998.Google Scholar
3. King, Y.C., King, T.J., Hu, C., Tech. Dig. – Int. Electron. Devices Meet., 115, 1998.Google Scholar
4. Ahn, C.G., Kang, H.S., Kwon, Y.K., Lee, S.M., Ryum, B.R., Kang, B.K., J. Appl. Phys. 86, 1542, 1999.Google Scholar