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Sustained Percolation in Stretched Silver Nanowire Networks for Stretchable Inter-Connection Applications

Published online by Cambridge University Press:  26 June 2014

Jae Sung Park  and
Woo Soo Kim
Jae Sung Park
Affiliation:
School of Mechatronic Systems Engineering, Simon Fraser University, Surrey, B.C. Canada V3T 0A3
Woo Soo Kim
Affiliation:
School of Mechatronic Systems Engineering, Simon Fraser University, Surrey, B.C. Canada V3T 0A3
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Abstract

Here we introduce a highly stretchable Printed Circuit Board (PCB) inter-connection technology achieved through the combination of flexibility allowed by the silver nanowire (AgNW)-based electrode and stretchability provided by the meander-shaped substrate. Horseshoe-shaped elastic material, polydimethylsiloxane, is used as a substrate of the AgNW conductors for relaxed stress concentration. Continuously maintained 2-D percolation of stretchable AgNW networks overcomes the usage restrictions with ordinary rigid Printed Circuit Board (PCB). The horseshoe-shaped inter-connection is physically reliable with repeated stretching/releasing processes and maintains its conductivity under tensile strains up to 20 %, allowing the durable and stretchable PCB inter-connecting applications.

Keywords

electronic materialmetallic conductorspray deposition
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1685: Symposium U – Soft Nanomaterials , 2014 , mrss14-1685-u02-09
Copyright
Copyright © Materials Research Society 2014 

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References

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