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SU-8 Processing on a Variety of Substrates

Published online by Cambridge University Press:  10 February 2011

Yuh-Min Chiang ,
Mark Bachman ,
Hung-Pin Chang ,
Charles Chu  and
G. P. Li
Yuh-Min Chiang
Affiliation:
Department of Computer and Electrical EngineeringUniversity of California at IrvineIrvine, CA 92697-2625
Mark Bachman
Affiliation:
Department of Computer and Electrical EngineeringUniversity of California at IrvineIrvine, CA 92697-2625
Hung-Pin Chang
Affiliation:
Department of Computer and Electrical EngineeringUniversity of California at IrvineIrvine, CA 92697-2625
Charles Chu
Affiliation:
Department of Computer and Electrical EngineeringUniversity of California at IrvineIrvine, CA 92697-2625
G. P. Li
Affiliation:
Department of Computer and Electrical EngineeringUniversity of California at IrvineIrvine, CA 92697-2625
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Abstract

SU-8 has become a popular material for micromachining high aspect ratio structures. Typically, SU-8 is spun on a polished silicon wafer for processing. After patterning, the SU-8 is used for micromachined structures directly (such as fluidic channels) or as a mold for electroforming. Non-silicon substrates offer the possibility of cheaper processing, improved mold designs, and multi-material devices. Successful SU-8 processing depends strongly on surface properties of the substrate itself as well as environmental conditions during the processing. We explore the issues involved in transferring SU-8 technology to non-silicon substrates such as glass, plastics and metals. Issues such as wettability, adhesion, and surface tension are explored in this study. The findings indicate the merits of non-spinning approaches, such as dipping, spraying, and brushing and point to new SU-8 processes.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 605: Symposium MM – Materials Science of Microelectromechanical Systems Devices II , 1999 , 91
Copyright
Copyright © Materials Research Society 2000

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References

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