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Study of Practical Adhesion of Metals to Glass Substrates

Published online by Cambridge University Press:  10 February 2011

C. Zhou ,
P. Su ,
M. A. Korhonen  and
C-Y. Li
C. Zhou
Affiliation:
Dept. of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
P. Su
Affiliation:
Dept. of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
M. A. Korhonen
Affiliation:
Dept. of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
C-Y. Li
Affiliation:
Dept. of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
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Abstract

Metallic coatings on glass substrates are widely used in various microelectronic components. However, sometimes high residual stress generated in the deposition process or after leads to the loss of adhesion between the coating and the substrate, posing a threat to the reliability of the whole device. In this paper we showed results of our study of Cr and Cu metallizations on glass, which are of technological interest as conductors in the flat panel displays. Stress measurement and nanoindentation techniques are used to find out the stress state and probe the interfacial adhesion properties of the thin metallizations. Ways to increase the practical adhesion of the metallization to ceramic substrates will be discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 522: Symposium T – Fundamentals of Nanoindentation & Nanotribology , 1998 , 377
Copyright
Copyright © Materials Research Society 1998

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References

[1] Guilbaud-Massereau, V., Clerier, A., J. Machet, Thin Solid Films 258(1995) 185–193 Google Scholar
[2] Janda, M., Stefan, O., Thin Solid Films 112(1984) 127–137 Google Scholar
[3] Buckel, W., J. Vac. Sci. Technol.,6,606,1969 Google Scholar
[4] Chaudhari, P., Vac. Sci. Technol. 9,520,1972 Google Scholar
[5] Hoffman, R.W., Phys. Thin Films, 3,211,1966 Google Scholar
[6] Hoffman, R. W., Thin Solid Films, 34,185,1976 Google Scholar
[7] Frank Felhner, private communication.Google Scholar
[8] Korhonen, M. A., Paszkiet, C. A., et al, Scripta Metallurgica et Materialia, 24(1990) 2297 Google Scholar
[9] Stone, D., LaFontaine, W.R., Wu, T.-W., Alexopoulos, P.S., and Li, C.Y., J. Mater. Res., 3 (1990), 141 Google Scholar
[10] Oliver, W. C., McHargue, C. J., Thin Solid Films, 161 (1988) p.117 Google Scholar
[11] Vlassak, Joost J., Nix, W. D., J. Mech. Phys. Solids, Vol. 42, No. 8, pp 1223–1245, 1994 Google Scholar
[12] Thornton, J. A., Hoffman, D. W., Thin Solid Films, 171(1989) 5–31 Google Scholar
[13] Hutchinson, J. W., Suo, Z., Advances in Applied Mechanics, vol. 29, 1992, p. 6 3- 19 1Google Scholar