Hostname: page-component-78c5997874-g7gxr Total loading time: 0 Render date: 2024-11-02T23:03:34.004Z Has data issue: false hasContentIssue false

Structural and Optical Features of Nano-Crystalline Silicon Films Prepared by Pecvd and Rf Magnetron Sputter Techniques

Published online by Cambridge University Press:  17 March 2011

M.-B. Park
Affiliation:
Department of Materials Science and Engineering, Inha University, Inchon 402-751, Korea
N.-H. Cho
Affiliation:
Department of Materials Science and Engineering, Inha University, Inchon 402-751, [email protected]
Get access

Abstract

Nano-crystalline Si films were prepared by plasma enhanced chemical vapor deposition (PECVD) and rf-magnetron sputter techniques at various deposition conditions, and the relations of the photoluminescence (PL) phenomena of the films with process variables are discussed. The phase of the films prepared at R.T. by PECVD techniques is somewhere between amorphous and crystalline states, consisting of nano-crystallites of size ranging from 3.2 to 5.3 nm. These films exhibit significant PL intensities near blue light region; the PL peaks shift from 510 to 460 nm with decreasing the reaction gas (SiH4) fraction from 4.7 to 2.0%. The films prepared at 500 °C by PECVD are composed of about 5 and 150 nm crystallites, exhibiting little PL phenomena. The PL intensity of the films prepared by sputter techniques was observed to increase with raising the sputter power and the post-deposition heat-treatment temperature.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Bruno, G., Capezzuto, P. and Madan, A., Plasma Deposition of Amorphous silicon-Based Materials, Academic Press, San Diego, 1998.Google Scholar
[2] Kelly, M. T., Chen, J. K. M. and Bocarsly, A. B., Appl. Phys. Lett., 62, 1693 (1994).Google Scholar
[3] Wolf, S. and Tauber, R. N., Silicon Processing for VLSI Era, Lattice Press, Sunset Beach, 1986.Google Scholar
[4] Cullis, A. G. and Canham, L. T., Nature, 353, 335 (1991).10.1038/353335a0Google Scholar
[5] Guha, S., Thin Solid Films, 297, 102 (1997).Google Scholar
[6] Mizuno, H., Koyama, H. and Koshino, N., Thin Solid Films, 297, 61 (1997).10.1016/S0040-6090(96)09476-XGoogle Scholar
[7] Liu, H. and Xu, M., Solid State Commun., 58, 601 (1986).Google Scholar
[8] Kimura, K. and Iwasaki, S., Jpn. J. Appl. Phys., 38, 609 (1999).Google Scholar
[9] Surynarayna, C. and Norton, M. G., X-Ray Diffraction: A Practical Approach, Plenum Press, New York and London, 1998.Google Scholar
[10] Moulder, J. F., Stickle, W. F., Sobel, P. E. and Bomben, K. D., Handbook of X-ray Photoelectron Spectrosocpy, Perkin-Elmer Co., Minnesota, 1992.Google Scholar
[11] Hiraki, A., Fukushima, Y., Sato, T., Kiyono, H., Terauchi, H. and Imura, Y., J. Non-Cryst. Solids, 59 & 60, 791 (1983).Google Scholar