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Strain Modification and Thermal Stability of SixGe1−x Films Grown by Ion-Assisted Molecular Beam Epitaxy

Published online by Cambridge University Press:  26 February 2011

C. J. Tsai
Affiliation:
Thomas J. Watson Laboratory of Applied Physics California Institute of Technology, Pasadena, CA 91125, USA
H. A. Atwater
Affiliation:
Thomas J. Watson Laboratory of Applied Physics California Institute of Technology, Pasadena, CA 91125, USA
T. Vreeland
Affiliation:
Thomas J. Watson Laboratory of Applied Physics California Institute of Technology, Pasadena, CA 91125, USA
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Abstract

Significant changes in strain are produced in SixGe1−x epitaxial films grown on Si and Ge (001) substrates as a result of low energy ion beam assisted molecular beam epitaxy (IAMBE). Films grown with concurrent Ar+ or Xe+ ion bombardment are coherent and uniformly strained in the growth direction by up to 1.5% in Ge films and 0.5% in Si films and contain no dislocations. The dependence of the films strain perpendicular to the growth surface on ion-atom flux ratio, and ion energy can be explained by the injection of uniformly distributed point defects. Post-growth isochronal annealing of SixGe1−x films suggests that the existing defects in the IAMBE films are defect complexes and that the strain relaxation path is determined by the overall thermodynamic driving force toward the strain-relieved state.

Type
Research Article
Copyright
Copyright © Materials Research Society 1991

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References

[1] Jesser, W.A. and van der Merwe, J.H., Dislocations in Solids, 8, edited by Nabarro, F. R. N. (Elsevier Science Publishers, 1989), P. 421.Google Scholar
[2] People, R. and Bean, J.C., Appl. Phys. Lett. 47, 322 (1985).Google Scholar
[3] Tsao, J.Y., Dodson, B.W., Picraux, S.T., and Cornelison, D.M., Phys. Rev. Lett. 59, 2455 (1987).Google Scholar
[4] Hull, R. and Bean, J.C., J.Vac. Sci. Technol. A 7, 2580 (1989).Google Scholar
[5] Greene, J.E., CRC Critical Reviews in Solid State and Materials Science, 2, 47 (1983).Google Scholar
[6] Choi, C.-H., Hultman, L., and Barnett, S.A., J. Vac. Sci. Technol. A3, 1587 (1990)Google Scholar
[7] Zuhr, R.A., Pennycook, S.J., Noggle, T.S., Herbots, N. Haynes, T.E., and Apple-ton, B.R., Nucl. Instr. and Meth. B 37/38, 16 (1989).Google Scholar
[8] Zalm, P.C. and Beckers, L.J., Appl. Phys. Lett. 41 167 (1982).Google Scholar
[9] Wie, C.R., Tombrello, T.A., and Vreeland, T., J. Appl. Phys. 59, 3743 (1986).Google Scholar
[10] Brice, D.K., Tsao, J.Y. and Picraux, S.T., Nucl. Instrum and Methods 44, 6878 (1989).Google Scholar