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Sol-Gel Process Derived Superhydrophobic Silica Thin Films for Antistiction of MEMS Devices

Published online by Cambridge University Press:  01 February 2011

ChingPing Wong ,
Lingbo Zhu ,
Dennis W Hess  and
C. P. Wong
ChingPing Wong
Affiliation:
[email protected], Georgia Institute of Technology, School of Materials Science and Engineering, 771 Ferst Drive, Atlanta, GA, 30332, United States
Lingbo Zhu
Affiliation:
[email protected], Georgia Institute of Technology, Chemical and Biomolecular Engineering, 311 Ferst Drive, Atlanta, GA, 30332, United States
Dennis W Hess
Affiliation:
[email protected], Georgia Institute of Technology, Chemical and Biomolecular Engineering, 311 Ferst Drive, Atlanta, GA, 30332, United States
C. P. Wong
Affiliation:
[email protected], Georgia Institute of Technology, Materials Science and Engineering, 771 Ferst Drive, Atlanta, GA, 30332, United States
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Abstract

Based on the theory of superhydrophobicity for low surface energy coatings, we describe a superhydrophobic antistiction silica coating for MEMS devices. The process uses a novel sol-gel process sequence with a eutectic liquid as a templating agent. The eutectic liquid displays negligible vapor pressure and very low melting point (12°C at ambient conditions) to reduce solvent loss during the high speed spincoating process. After a fluoroalkyl silane treatment, superhydrophobicity is achieved on the as-prepared silica thin film. The solvent can be extracted after the gelation and aging processes. Spin speed effect, eutectic liquid:TEOS ratio in the solution were studied in order to optimize the surface roughness to ensure excellent super-hydrophobicity. Comparison of the silica thin films with silicon pillar surfaces showed that superhydrophobicity for the traditional sol-gel derived silica films demonstrated significant improvement, especially under humid conditions. The AFM force curve obtained with a tipless probe showed that the interaction force is greatly reduced on a rough silica superhydrophobic surface. This result offers great potential to reduce stiction failures in MEMS devices.

Keywords

sol-gelmicroelectro-mechanical (MEMS)adhesion
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 990: Symposium B – Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics , 2007 , 0990-B05-02
Copyright
Copyright © Materials Research Society 2007

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References

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