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Reliability in Mechatronics Systems from TEM, SEM and SE Material Analysis

Published online by Cambridge University Press:  31 January 2011

Pierre Dahoo ,
Nadim Alayli ,
Armelle Girard ,
Philippe Pougnet ,
Ky-Lim Tan  and
Jean-Michel Morelle
Pierre Dahoo
Affiliation:
[email protected]@uvsq.fr
Nadim Alayli
Affiliation:
[email protected], University of Versailles St Quentin, Physics & Engineering Science Department, Versailles, France
Armelle Girard
Affiliation:
[email protected], University of Versailles St Quentin, Physics & Engineering Science Department, Versailles, France
Philippe Pougnet
Affiliation:
[email protected], VALEO VEMS, Cergy Pontoise Cedex, France
Ky-Lim Tan
Affiliation:
[email protected], VALEO VECS, Montigny Le Bretonneaux, France
Jean-Michel Morelle
Affiliation:
[email protected], VALEO VECS, Montigny Le Bretonneaux, France
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Abstract

Mechatronic systems designed to comply to new EU directives are studied through interconnections by electronic or photonic probes, SEM, TEM, SE or 3D Tomography. Leaded and lead free modules assembled by standard interconnection technologies are studied for robustness relative to thermal accelerated life tests. Results obtained from JEOL 6060LV SEM and Optical Microscopy show that although slow growth rate of inter-metallics (IMC) is consistent with expected reliability, they are responsible for propagation of cracks especially in the presence of gold on PCB side. Innovative Low Temperature Joining (LTJ) technology applied to nano or micro silver pastes which should reduce IMC effects are tested on mechatronic systems. Results obtained from SEM, TEM and 3D Tomography will be shown as well as non destructive Spectroscopic Ellipsometry studies of samples. Pressureless LTJ technology is unsuitable for robust interconnection.

Keywords

sinteringscanning electron microscopy (SEM)thermal stresses
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1195: Symposium B – Rellliability and Materials Issues of Semiconductor Optical and Electrical Devices and Materials , 2009 , 1195-B07-04
Copyright
Copyright © Materials Research Society 2010

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References

1. Martz, M., Focus on Mechatronics, technology choices for automotive applications, Proceedings of the 2nd International Conference Automotive Power Electronics (APE), France September 2007 Google Scholar
2. Coquery, G., Morelle, J.M. and Trias, D., Packaging of active power switching modules: a review in the context of automotive applications, Proceedings of the 1st International Conference Automotive Power Electronics (APE), France, June 2006 Google Scholar
3. Khabir, Z., Lefevre, S., Richardeau, F., Reliability challenges of power electronics modules in automotive environment, Sensors and Actuators for advanced automotive applications (SENSACT) conference, ESIEE SIA Sponsor, France, December 2005 Google Scholar
4. Zhang, Z.Z, Bai, J., Lu, G-Q, Yin, J., Wyk, J.D. Van, Liang, Z., Zhu, L. and Chow, T.P., Low-Temperature Sintering Nanoscale Silver Paste as an High Temperature Packaging Solution; Proceedings of the Int. Conf..on Power Electronics (CPES) USA, April 2005 Google Scholar