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Rational Design of Highly Filled Reactive Resins for Electronic Material Applications with Multiple Performance Constraints

Published online by Cambridge University Press:  26 February 2011

Daniel J Duffy  and
Allison Xiao
Daniel J Duffy
Affiliation:
[email protected], National Starch & Chemical Company, Corporate Research, 10 Finderne Ave., Bridgewater, NJ, 08807, United States, (908) 685-5267, (908) 685-7400
Allison Xiao
Affiliation:
[email protected], National Starch & Chemical Company, 10 Finderne Ave., Bridgewater, NJ, 08807, United States
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Abstract

Cyanate ester resin and its blends with epoxy resin demonstrate a lower viscosity build up when filled with thermally treated silica fillers than with untreated silica fillers. The reduced viscosity build up resulting from the use of the thermally treated materials results in faster capillary flow rates by a factor of 2 to 5 with respect to untreated silica particles. Surface properties of the filler materials are used to interpret the viscosity and flow rate data and guide design of filler surface properties. The flow rate performance improvement contributes to design of new capillary underfill materials for electronic materials applications.

Keywords

surface chemistryviscoelasticityparticulate
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 968: Symposium V – Advanced Electronic Packaging , 2006 , 0968-V07-04
Copyright
Copyright © Materials Research Society 2007

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References

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