Hostname: page-component-586b7cd67f-r5fsc Total loading time: 0 Render date: 2024-11-28T06:27:46.330Z Has data issue: false hasContentIssue false

Pyroelectric Effects on 1T-1C Fram and 1Tr Fram

Published online by Cambridge University Press:  10 February 2011

In Kyeong Yoo
Affiliation:
Electronic Materials Lab., Samsung Advanced Institute of Technology, P.O. Box 111, Suwon, Kyongki, Korea
I.S. Chung
Affiliation:
Electronic Materials Lab., Samsung Advanced Institute of Technology, P.O. Box 111, Suwon, Kyongki, Korea
C.J. Kim
Affiliation:
Electronic Materials Lab., Samsung Advanced Institute of Technology, P.O. Box 111, Suwon, Kyongki, Korea
J.K. Lee
Affiliation:
Electronic Materials Lab., Samsung Advanced Institute of Technology, P.O. Box 111, Suwon, Kyongki, Korea
B.K. Jeon
Affiliation:
Samsung Electronics Co., Ltd., Suwon, Kyongki, Korea
S.B. Desu
Affiliation:
Materials and Science Engineering Dept., VA Tech, VA24061, USA
Get access

Abstract

Pyroelectric effect on ferroelectricity was examined for PZT capacitors with diodes in series. It was observed that the magnitude of the polarization reversal increases as heating rate increases. The polarization reversal begins to decrease as heating rate becomes very high, which may stem from the fact that pyroelectric charges flow through the PZT film at high temperature as the film loses its resistance at the elevated temperature. A pure remanent polarization reversal model is suggested for the polarization reversal caused by pyroelectric charges. Based on the above results, a thermal shock test method is proposed for quality control of FRAM products. The thermal shock test reveals that pyroelectric effect can be minimized by controlling process for 1T-1C FRAM. It was also observed, by the thermal shock test, that imprint dominates pyroelectric effect in 1Tr cell with MFIS structure.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Yoo, I.K., Desu, S.B., and Evans, J.T. Jr, “Proposed Test Standards for Pyroelectric Effects on Ferroelectric Memories,” Submitted, IEEE Thin-Film Ferroelectric Materials Standards Committee, 1995.Google Scholar
2. Yoo, I.K., Kim, C.J., and Desu, S.B., “Retentivity Studies on PZT Thin Film Capacitors,” MRS Symp. Proc. vol.433, pp.273, 1996.Google Scholar
3. Liu, S.T. and Zook, J.D., Ferroelectrics, vol.7, pp.171, 1974.Google Scholar
4. Ramesh, R., Chan, W.K., Wilkens, B., Sands, T., Tarascon, J.M., and Evans, J.T. Jr, “Fatigue and Ageing in Ferroelectric PZT/YBCO Heterostructures,” Integrated Ferroelectrics, vol.1, pp.1, 1992.Google Scholar
5. Edited by Yoo, I.K. and Evans, J.T. Jr, “IEEE Thin-Film Ferroelectric Materials Standards,” Submitted, IEEE Thin-Film Ferroelectric Materials Standards Committee, 1996.Google Scholar
6. Yoo, I.K., Kim, C.J., and Desu, S.B., “Breakdown Mechanisms in PZT Thin Film Capacitors,” Integrated Ferroelectrics, vol.11, pp.269, 1995.Google Scholar
7. Traynor, S., Private communication, Ramtron, 1997.Google Scholar
8. Yoo, I.K. and Desu, S.B., “Breakdown in PZT Thin Film Capacitors,” Proc of the 9t” IEEE International Symp. on Applications of Ferroelectrics. Pp.531, 1994.Google Scholar
9. Lines, M.E. and Glass, A.M., “Principles and Applications of Ferroelectrics and Related Materials,” Clarendon Press, pp.141, 1982.Google Scholar