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Preparation and Characterization Silver and Copper Layers on Polyimide Prepared by Electroless Copper Plating
Published online by Cambridge University Press: 01 February 2011
Abstract
Ag particles were generated on Ag+-doped polyimide film by ion exchanging, followed by copper deposition using metallic silver particles as seeds. The Cu layers were coated on the surface of polyimide films by electroless plating method. The surface image and morphology of Cu layers on the polyimide films were characterized with scanning electron microscopy (SEM), and atomic force microscopy (AFM). The chemical composition on the PI film was investigated energy dispersive X-ray (EDX) spectrometer.
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