No CrossRef data available.
Article contents
Post-etch treatment enabled electroless copper metallization of porous dielectric
Published online by Cambridge University Press: 29 May 2013
Abstract
This paper describes an alternate two-step metallization scheme for porous dielectrics. The patterned dielectric surface is first treated in a plasma etch chamber where the dielectric surface is coated with a very thin carbon-based film. This is followed by electroless copper deposition. The plasma post-etch treatment (PET) film seals the pores of the dielectric, minimizes dielectric damage, and functionalizes the dielectric to enable electroless plating.
Keywords
- Type
- Articles
- Information
- Copyright
- Copyright © Materials Research Society 2013