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Post-etch treatment enabled electroless copper metallization of porous dielectric

Published online by Cambridge University Press:  29 May 2013

Yezdi N. Dordi
Yezdi N. Dordi*
Affiliation:
Lam Research Corp., 4400 Cushing Parkway Fremont, CA 94538, U.S.A.
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Abstract

This paper describes an alternate two-step metallization scheme for porous dielectrics. The patterned dielectric surface is first treated in a plasma etch chamber where the dielectric surface is coated with a very thin carbon-based film. This is followed by electroless copper deposition. The plasma post-etch treatment (PET) film seals the pores of the dielectric, minimizes dielectric damage, and functionalizes the dielectric to enable electroless plating.

Keywords

platingdielectricporosity
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1559: Symposium AA – Advanced Interconnects for Micro- and Nanoelectronics—Materials, Processes and Reliability , 2013 , mrss13-1559-aa04-01
Copyright
Copyright © Materials Research Society 2013 

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References

REFERENCES

Yoshino, M., Masuda, T., Yokoshima, T., Sasano, J., Shacham-Diamand, Y., Matsuda, I., Osaka, T., Hagiwara, Y., and Sato, I., Journal of the Electrochemical Society 154(3) (2007), D122–D125 CrossRefGoogle Scholar
Charbonnier, M. and Romand, M., International Journal of Adhesion and Adhesives. 23 (2003) 277–285 CrossRefGoogle Scholar
Xie, Q., Jiang, Y., Musschoot, J., Deduytsche, D., Detavernier, C., Van Meirhaeghe, R., Van den Berghe, S., Ru, G., Li, B., Qu, X., Thin Solid Films 517 (2009) 4689–4693 CrossRefGoogle Scholar