Published online by Cambridge University Press: 26 February 2011
a-Si:H films rf sputtered in 10 mT He and 0.5 mT H2, in contrast to those prepared in Ar/H2 or Xe/H2, exhibit port depositional oxidation when sputtered at power levels of 0.55 – 3.3 W/cm2 (100 – 600W). SEM measurements show that the morphology of the films evolves from a cracked, microcrystalline, glassy one at higher rf power levels to a porous one at low power levels. This trend is also correlated with a sharply increasing density of Si-H2 dihydride bonds at decreasing rf levels. Auger depth profiles of the oxygen concentration in the films agree with a diffusion controlled process of a source solute of O2 molecules into a semi-infinite solid solvent. Yet IR absorption measurements indicate that the oxygen is confined to the internal surfaces of the microvoids. The diffusion constant is a very sensitive functi n of the sputtering conditions. At low rf power levels, it is as low as 10−16 – 10−1 cm2 /sec at room temperature, but increases to ∼10−13 at 250 – 350°C.These results are discussed in terms of a porous network of microvoids, through which the O2 “squeezes” into the film.