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Polymer Assisted Deposition (PAD) of thin metal films: A new technique to the preparation of metal oxides and reduced metal films

Published online by Cambridge University Press:  26 February 2011

Piyush Shukla
Affiliation:
[email protected], Los Alamos National Laboratory, Chemistry, MSJ514, Los Alamos, NM, 87544, United States, 5056673588
Yuan Lin
Affiliation:
[email protected], Los Alamos National Laboratory
Edel M Minogue
Affiliation:
[email protected], Los Alamos National Laboratory
Anthony K Burrell
Affiliation:
[email protected], Los Alamos National Laboratory
T Mark McCleskey
Affiliation:
[email protected], Los Alamos National Laboratory
Quanxi Jia
Affiliation:
[email protected], Los Alamos National Laboratory
Ping Lu
Affiliation:
[email protected], New Mexico Institute of Mining and Technology
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Abstract

Currently, there are a variety of techniques to deposit metal thin films ranging from high vacuum techniques such as chemical vapor deposition (CVD) and physical vapor deposition (PVD), through to solution methods like sol-gel. While the vacuum techniques can be limited by size and cost, sol-gel can be limited be the availability of appropriate precursors. All of these techniques have the further limitation that they cannot be used to coat porous materials conformally.

Polymer assisted deposition (PAD) addresses some of the limitations of sol-gel and costs of high vacuum techniques. PAD utilizes an aqueous polymer to bind a metal or metal complex that serves both to encapsulate the metal to prevent chemical reaction and maintain an even distribution of the metal in solution. Another advantage that PAD has is that the same solution can be used as precursors for the growth of metal oxide or reduced metal films. Herein, we report on the utility of PAD in preparing metal oxide films used to conformally coat porous material and reduced metal films.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

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References

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