Hostname: page-component-586b7cd67f-r5fsc Total loading time: 0 Render date: 2024-11-28T21:40:52.418Z Has data issue: false hasContentIssue false
  • English
  • Français

Planar Extrinsic Biasing Of Thin Film Shape-Memory MEMS Actuators.

Published online by Cambridge University Press:  11 February 2011

D. S. Grummon ,
R. Gotthardt  and
T. LaGrange
D. S. Grummon
Affiliation:
Michigan State University, Dept. of Chem. Eng. and Materials Science, E. Lansing, MI 48824
R. Gotthardt
Affiliation:
Swiss Federal Tech. Inst. of Lausanne (EPFL), Inst. of Physics of Complex Matter, Ecublens, CH-1015, Switzerland.
T. LaGrange
Affiliation:
Swiss Federal Tech. Inst. of Lausanne (EPFL), Inst. of Physics of Complex Matter, Ecublens, CH-1015, Switzerland.
Get access

Abstract

Although slow and dissipative, sputtered thin-film shape-memory alloys like equiatomic titanium-nickel can exert a large ohmically-excited force displacement product when deployed in photolithographically micromachined actuators. They give energy densities far exceeding those typically produced by competing microactuator materials [1], and their size can probably be scaled down to the nanometer range (where the benefits of high surface to volume ratio are best exploited for speed and efficiency). But a large, energetic, and resettable actuation stroke is possible only if some agency has imparted a non-trivial initial plastic strain, of between one and five percent, to the martensite phase. Is not always obvious how this strain is to be achieved when discrete mechanical manipulation of the active element is difficult. Furthermore, for cyclic actuation, a resetting-force that periodically re-deforms the martensite during the cooling interval must arise naturally from mechanical elements in the design. Here, several methods responding these requirements are discussed in relation to various kinematic themes.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 750: Symposium Y – Surface Engineering 2002–Synthesis, Characterization and Applications , 2002 , Y7.9/J13.9
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Wolf, R. H. and Heuer, A. H., J. Microelectromechanical Systems 4, 206–212 (1995).Google Scholar
2. Walker, J. A. and Gabriel, J., “Thin Film Processing of TiNi Shape Memory Alloy“, Proc. 5th Int. Conf. on Solid State Sensors and Actuators, Montreaux, Switzerland, June 1989, ext. abstr. B8, p123 (1989).Google Scholar
3. Busch, J.D., Johnson, A.D., Hodgson, D.E., Lee, C.H., and Stevenson, D.A., Proc Intl. Conf on Martensitic Transformations, ICOMAT 1989.Google Scholar
4. Zhang, J., Li, Hou and Grummon, D. S., Proc. Mater. Res. Soc. 459, p451 (1997).Google Scholar
5. Lee, A.P., Ciarlo, D.R., Krulevitch, P.A., Lehew, S., Trevino, J., and Northrup, M.A., Sensors & Actuators A, 54, 755 (1996).Google Scholar
6. Hua, S. Z., Su, C. M., and Wuttig, M., Proc. Mat. Res. Soc. Symp. 308, (1993).Google Scholar
7. Grummon, D. S. and Zhang, J., Phys. Stat. Sol. (a) 186, 17–39 (2001).Google Scholar
8. Grummon, D. S. and Gotthardt, Rolf, Acta Met. and Mater. 48 pp 635–646 (2000).Google Scholar
9. Wu, X., Grummon, D.S. and Pence, T. J., Simulation of cyclic displacement by counterpoised shape memory elements, ASME J. Engineering Materials and Technology, 121 (1999), pp. 67–74.Google Scholar
10. Ni, W., and Grummon, D. S., and Cheng, Y-T., J. Appl. Phys. Lett, 80, 3310 (2000)Google Scholar