Published online by Cambridge University Press: 15 February 2011
A new method for making p-n junctions based on immersion in a transparent dopant gas followed by irradiation with a pulsed laser is presented. The surface of the wafer melts, dopant from the gas dissolves in it, and is distributed by liquid diffusion before epitaxial regrowth. This technique, termed GILD for Gas Immersion Laser Diffusion, was used to make solar cells in both monocrystalline and polycrystalline silicon.
Laser photocurrent scanning shows that grain boundary recombination is reduced or eliminated in cells made by the GILD technique and current collection is enhanced at some grain boundaries. Heat treatment at 850 ° C prior to GILD causes the same grain boundaries to be recombination active as they are in ordinary diffused cells.