Hostname: page-component-586b7cd67f-2brh9 Total loading time: 0 Render date: 2024-11-28T18:44:17.313Z Has data issue: false hasContentIssue false
  • English
  • Français

A Novel Micro Tensile Testing Instrument with Replaceable Testing Specimen by Parylene Passivation Technique

Published online by Cambridge University Press:  01 February 2011

Yung-Dong Lau ,
Tso-Chi Chang ,
Hong Hocheng ,
Rongshun Chen  and
Weileun Fang
Yung-Dong Lau
Affiliation:
[email protected], National Tsing Hua University, Power Mechanical Engineering, 101, Section 2, Kuang-Fu Road, Hsinchu, 30013, Taiwan, 886-3-5742605, 886-3-5739372
Tso-Chi Chang
Affiliation:
[email protected], National Tsing Hua University, Department of Power Mechanical Engineering, 101, Section 2, Kuang-Fu Road, Hsinchu, 30013, Taiwan
Hong Hocheng
Affiliation:
[email protected], National Tsing Hua University, Department of Power Mechanical Engineering, 101, Section 2, Kua ng-Fu Road, Hsinchu, 30013, Taiwan
Rongshun Chen
Affiliation:
[email protected], National Tsing Hua University, Department of Power Mechanical Engineering, 101, Section 2, Kuang-Fu Road, Hsinchu, 30013, Taiwan
Weileun Fang
Affiliation:
[email protected], National Tsing Hua University, Department of Power Mechanical Engineering, 101, Section 2, Kua ng-Fu Road, Hsinchu, 30013, Taiwan
Get access

Abstract

This study has successfully demonstrated a novel tensile testing approach to mount the thin film test specimen onto the MEMS instrument using microfabrication process. The MEMS instrument consists of thermal actuator, differential capacitance sensor, supporting spring. The thermal actuator applies tensile load on the test specimen to characterize the Young's modulus and the residual stress of thin films. As compare with the existing approaches, the problems and difficulties resulting from the alignment and assembly of thin film test specimens with the testing instrument can be prevented. Furthermore, the parylene passivation technique of MEMS fabrication process allows the changing of testing film materials easily. In application, the present approach has been employed to determine the Young's modulus and the residual stress of Al films.

Keywords

microelectro-mechanical (MEMS)elastic propertiesAl
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1052: Symposium DD – Microelectromechanical Systems–Materials and Devices , 2007 , 1052-DD02-08
Copyright
Copyright © Materials Research Society 2008

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Sharpe, W. N, Yuan, B., and Edwards, R. L, J. Microelectromech. Syst., 6, No. 3, 193–199 (1997).Google Scholar
2 Pearson, G. L, Read, W. T, and Feldmann, W. L, Acta. Metall., 5, 181–191 (1957).Google Scholar
3 Oliver, W. C, and Pharr, G. M, J. Mater. Res., 7, 1564–1583 (1992).Google Scholar
4 Vlassak, J. J and Nix, W. D, J. Mater. Res., 7, 3242–3249, (1992).Google Scholar
5 Haque, M. A, and Saif, M. T. A., J. Microelectromech. Syst., 10, No. 1, 146–152 (2001).Google Scholar
6 Zhu, Y., Barthelat, F., Labossiere, P. E, Moldovan, N., and Espinosa, H. D, 2003 SEM Annual Conference, Session 77, Paper 155 (2003).Google Scholar
7 Williams, K. R, Gupta, K., and Wasilik, M., J. Microelectromech. Syst., 12, No. 6, 761–778 (2003).Google Scholar
8 Fang, W., and Wickert, J. A, J. Micromech. Microeng., 6, 301–309 (1996).Google Scholar