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A Novel Method for Low-Resistivity Metal-Interconnection by Using Metallic Functional Liquids and Catalytically Generated Hydrogen Atoms

Published online by Cambridge University Press:  17 May 2012

Nguyen T. T. Kieu ,
Keisuke Ohdaira ,
Tatsuya Shimoda  and
Hideki Matsumura
Nguyen T. T. Kieu
Affiliation:
School of Materials Science, Japan Advanced institute of Science and Technology (JAIST), 1-1 Asahidai, Nomi, Ishikawa, 923-1292, Japan.
Keisuke Ohdaira
Affiliation:
School of Materials Science, Japan Advanced institute of Science and Technology (JAIST), 1-1 Asahidai, Nomi, Ishikawa, 923-1292, Japan.
Tatsuya Shimoda
Affiliation:
School of Materials Science, Japan Advanced institute of Science and Technology (JAIST), 1-1 Asahidai, Nomi, Ishikawa, 923-1292, Japan.
Hideki Matsumura
Affiliation:
School of Materials Science, Japan Advanced institute of Science and Technology (JAIST), 1-1 Asahidai, Nomi, Ishikawa, 923-1292, Japan.
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Abstract

A novel method to make low-resistivity metal lines in assembled silicon (Si) integrated circuit (IC) chips or other semiconductor chips with high-speed and low-cost is demonstrated. In the method, functional silver (Ag)-liquid (Ag-ink) which contains Ag nanoparticles (NPs) in organic solution is used to draw metal-lines in trenches formed on a plastic substrate by imprint technology. Surface energy of trenches is modified by exposing the substrate to ultra-violet (UV) light with the purpose of concentrating the functional Ag-ink into trenches by capillary effect in order to connect with electrodes of Si chips. The resistivity of such metal-lines can be lowered to 4×10-6 Ωcm by exposing the Ag metal-lines to hydrogen (H) atoms generated by catalytic cracking reaction with a heated tungsten catalyzer. X-ray photoelectron spectroscopy (XPS) proves that H atoms can remove organic compounds surrounding Ag NPs, resulting in the low-temperature sintering of NPs as confirmed by scanning electron microscopy (SEM). The method is promising for low-cost fabricating of IC cards or other electronic devices utilizing assemble of many semiconductor chips.

Keywords

ink-jet printingmicroelectronicssintering
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1401: Symposium T – Large-Area Processing and Patterning for Active Optical and Electronic Devices III , 2012 , mrsf11-1401-t05-30
Copyright
Copyright © Materials Research Society 2012

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References

REFERENCES

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