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Novel Ceria-Polymer Composites for Reduced Defects during Oxide CMP

Published online by Cambridge University Press:  31 January 2011

Cecil Coutinho ,
Subramanya Mudhivarthi ,
Ashok Kumar  and
Vinay Gupta
Cecil Coutinho
Affiliation:
[email protected], University of South Florida, Chemical Engineering, Tampa, Florida, United States
Subramanya Mudhivarthi
Affiliation:
[email protected], University of South Florida, Mechanical Engineering, Tampa, Florida, United States
Ashok Kumar
Affiliation:
[email protected], University of South Florida, Mechanical Engineering, Tampa, Florida, United States
Vinay Gupta
Affiliation:
[email protected], University of South Florida, Chemical Engineering, Tampa, Florida, United States
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Abstract

To meet the stringent requirements of device integration and manufacture, surface defects and mechanical stresses that arise during chemical mechanic planarization (CMP) must be reduced. Towards this end, we have synthesized multiple hybrid and composite particles on micron length scales consisting of siloxane co-polymers functionalized with inorganic nanoparticles. These particles can be easily tailored during synthesis, leading to softer or harder abrasion when desired. Upon using these particles for the planarization of silicon oxide wafers, we obtain smooth surfaces with reduced scratches and minimal particle deposition, which is an improvement from conventional abrasive materials like pure silica, ceria and alumina nanoparticle slurries. Tribological characteristics during polishing were examined using a bench top CMP tester to evaluate the in situ co-efficient of friction. Characterization of the hybrid and composite particles has been done using infrared spectroscopy, dynamic light scattering, and electron microscopy. Surface roughness of the wafers was examined using atomic force and optical microscopy while removal rate measurements were conducted using ellipsometry at multiple angles.

Keywords

slurrypolymerizationCMP
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1157: Symposium E – Science and Technology of Chemical Mechanical Planarization (CMP) , 2009 , 1157-E06-04
Copyright
Copyright © Materials Research Society 2009

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