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Non-Destructive Evaluation of Strains and Voiding in Passgvated Copper Metallizations

Published online by Cambridge University Press:  15 February 2011

Richard P. Vinci ,
Thomas N. Marieb  and
John C. Bravman
Richard P. Vinci
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305
Thomas N. Marieb
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305
John C. Bravman
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305
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Abstract

Stress induced voiding in passivated Cu lines was investigated by x-ray strain analysis and in-situ high voltage scanning electron microscope (HVSEM) techniques. Cu lines on a Ta underlayer and Cu lines on an Al underlayer were patterned by a trilayer liftoff technique and passivated with Si3N4. For direct observation of stress voiding, specimens were heated to 350ºC in the HVSEM and then cooled and held at 150ºC. Identical samples were subjected to the same thermal cycle for strain state determination using x-ray techniques. The hydrostatic stress state at each temperature was calculated from the measured strains. Few initial voids were observed after passivation in either sample. After heating to 350ºC and cooling to the dwell temperature, no new voiding was seen in the Ta/Cu lines. Measured hydrostatic strains were half those measured in the Al/Cu lines. Heavy voiding was observed in the Al/Cu lines after cooling to the dwell temperature.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 308: Symposium M1 – Thin Films: Stresses and Mechanical Properties IV , 1993 , 297
Copyright
Copyright © Materials Research Society 1993

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References

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