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New Surface Functional Metal Powders for Anisotropic Conductive Film Materials in Electronic Package Application

Published online by Cambridge University Press:  11 February 2011

Shu-Chen Huang ,
Hsun-Tien Li ,
Kai-Chi Chen  and
Tzong-Ming Lee
Shu-Chen Huang
Affiliation:
Industrial Technology Research Institute, Materials Research Laboratories, Hsinchu, Taiwan
Hsun-Tien Li
Affiliation:
Industrial Technology Research Institute, Materials Research Laboratories, Hsinchu, Taiwan
Kai-Chi Chen
Affiliation:
Industrial Technology Research Institute, Materials Research Laboratories, Hsinchu, Taiwan
Tzong-Ming Lee
Affiliation:
Industrial Technology Research Institute, Materials Research Laboratories, Hsinchu, Taiwan
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Abstract

New metal powders containing organic thin film layer with multi-functional properties are prepared and used in the manufacturing of anisotropic conductive film (ACF) material for electronic package application. The organic thin film layer possesses both insulating property and thermo-compressed flowable property. The former insulating property ensures metal powder to have good insulation property at room temperature, and the latter thermo-compressed flowable property maintains the electric conductance of ACF material after high temperature compression process. Besides, the organic thin film layer also exhibited good steric hindrance to enhance the dispersion and anti-settling of metal powers in resin matrix. The functional organic groups on the surface thin film will also improve the interface adhesion between metal powder and resin matrix. Such metal powder with surface chemical modification is suitable for electronic material application, for example, anisotropic conductive film (ACF).

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 734: Symposia A/B – Defect-Mediated Phenomena in Ordered Polymers – Polymer/Metal Interfaces and Defect Mediated Phenomena in Ordered Polymers , 2002 , B9.13
Copyright
Copyright © Materials Research Society 2003

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References

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