Hostname: page-component-745bb68f8f-kw2vx Total loading time: 0 Render date: 2025-01-12T10:03:24.875Z Has data issue: false hasContentIssue false
  • English
  • Français

New Insight into the Banded Microstructure of Rapidly Solidified Ag-Cu Alloys : Experiment and Theory

Published online by Cambridge University Press:  26 February 2011

E. Y. Yankov ,
S. M. Copley ,
J. A. Todd  and
M. I. Yankova
E. Y. Yankov
Affiliation:
Illinois Institute of Technology, Department of Metallurgical and Materials Engineering, Chicago, IL 60616
S. M. Copley
Affiliation:
Illinois Institute of Technology, Department of Metallurgical and Materials Engineering, Chicago, IL 60616
J. A. Todd
Affiliation:
Illinois Institute of Technology, Department of Metallurgical and Materials Engineering, Chicago, IL 60616
M. I. Yankova
Affiliation:
Illinois Institute of Technology, Department of Metallurgical and Materials Engineering, Chicago, IL 60616
Get access

Abstract

A transmission electron microscopy study has revealed that the banded microstructure produced in Cu-61.7 at. pct. Ag after surface laser melting and resolidification is not due to a cellular breakdown of the interface as previously thought, but consists of alternating regions of the extended metastable solid solution, y, and a coupled growth structure containing thin plates of y and the copper-rich phase β'. The spacing of this coupled growth structure is approximately 100 Å, which is less than half the minimum spacing yet observed for coupled growth from the melt in Ag-Cu.

In order to explain the banded microstructure a theoretical model has been developed based on a finite elements solution of the diffusion equation in the melt, the interface response functions for continuous growth derived by Aziz and Kaplan and a recently developed theory for coupled growth that includes far-from-equilibrium regimes by Yankov et al..

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 205: Symposium F – Kinetics of Phase Transformations , 1990 , 307
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Elliot, W.A., Gagliano, F.P., and Krauss, G., Metall. Trans. A 4A, 2031 (1973).Google Scholar
2. Beck, D.G., Copley, S.M., and Bass, M., Metall. Trans. A 12A, 1687 (1981).Google Scholar
3. Beck, D.G., Copley, S.M., and Bass, M., Metall. Trans. A 13A, 1879 (1982).Google Scholar
4. Baker, J.C. and Cahn, J.W. in Solidification (ASM, Metals Park, OH, 1971) p. 23.Google Scholar
5. Boettinger, W.J., Shechtman, D., Schaefer, R.J., and Biancaniello, F.S., Metall. Trans. A 15A, 55 (1984).CrossRefGoogle Scholar
6. Mullins, W.W. and Sekerka, R.F., J. Appl. Phys. 34, 323 (1963)Google Scholar
7. Coriell, S.R. and Sekerka, R.F., J. Cryst. Growth 61, 499 (1983)CrossRefGoogle Scholar
8. Yankov, E.Y., Copley, S.M., Yankova, M.I., and Todd, J.A., in Proceedings of the Morris E. Fine Symposium, edited by Liaw, P.K., Weertman, J.R., Marcus, H.L., and Santner, J.S. (TMS, Warrendale, PA, 1991) in print.Google Scholar
9. Aziz, M.J. and Kaplan, T., Acta Metall. 36, 2335 (1988).Google Scholar
10. Murray, J.L., Metall. Trans. A 15A, 261 (1984).Google Scholar
11. Cline, H.E. and Anthony, T.R., J. Appl. Phys. 48, 3895 (1977).Google Scholar