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Nano-scale Conductive Films for High Performance Fine Pitch Interconnect

Published online by Cambridge University Press:  01 February 2011

Yi Li ,
Myung Jin Yim ,
Kyung Sik Moon  and
ChingPing Wong
Yi Li
Affiliation:
[email protected], Georgia Institute of Technology, School of Materials Science and Engineering, Atlanta GA 30332-0245, United States
Myung Jin Yim
Affiliation:
[email protected], Georgia Institute of Technology, School of Materials Science and Engineering, 771 Ferst Drive, Atlanta, GA, 30332, United States
Kyung Sik Moon
Affiliation:
[email protected], Georgia Institute of Technology, School of Materials Science and Engineering, Atlanta, GA, 30332-0245, United States
ChingPing Wong
Affiliation:
[email protected], Georgia Institute of Technology, School of Materials Science and Engineering, Atlanta, GA, 30332-0245, United States
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Abstract

In this paper, a novel nano-scale conductive film which combines the advantages of both traditional anisotropic conductive adhesives/films (ACAs/ACFs) and nonconductive adhesives/films (NCAs/NCFs) is introduced and developed for next generation high performance ultra-fine pitch packaging applications. This novel interconnect film possesses the properties of electrical conduction along the z-direction with relatively low bonding pressure (ACF-like) and the ultra-fine pitch (< 100 nm) capability (NCF-like). Unlike typical ACF which requires 1–5 vol% of conductive fillers, the novel nano-scale conductive film only needs less than 0.1 vol% conductive fillers to achieve good electrical conductance in the z direction. The nano-scale conductive film also allows a lower bonding pressure than NCF to achieve a much lower joint resistance (over two orders of magnitude lower than typical ACF joints) and higher current carrying capability. With low temperature sintering of nano-silver fillers, the joint resistance of the nano-scale conductive film could be as low as 10−5 Ohm, even lower than the NCF and lead-free solder joints. The reliability of the nano-scale conductive film after high temperature and humidity test (85°C/85%RH) was also improved compared to the NCF joints. As such, a high performance, fine pitch conductive film was developed.

Keywords

adhesivepackagingenvironmentally benign
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 990: Symposium B – Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics , 2007 , 0990-B05-05
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

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