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Nanoprober-Based Pick-and-Place Process for Site-Specific Characterization of Individual Carbon Nanotubes

Published online by Cambridge University Press:  01 February 2011

Thomas Hantschel
Affiliation:
[email protected], IMEC, AMPS, Kapeldreef 75, Leuven, B-3001, Belgium
Peter Ryan
Affiliation:
[email protected], IMEC, AMPS, Kapeldreef 75, Leuven, B-3001, Belgium
Saku Palanne
Affiliation:
[email protected], IMEC, AMPS, Kapeldreef 75, Leuven, B-3001, Belgium
Oliver Richard
Affiliation:
[email protected], IMEC, AMPS, Kapeldreef 75, Leuven, B-3001, Belgium
Kai Arstila
Affiliation:
[email protected], IMEC, AMPS, Kapeldreef 75, Leuven, B-3001, Belgium
Anne S. Verhulst
Affiliation:
[email protected], IMEC, AMPS, Kapeldreef 75, Leuven, B-3001, Belgium
Hugo Bender
Affiliation:
[email protected], IMEC, AMPS, Kapeldreef 75, Leuven, B-3001, Belgium
Xiaoxing Ke
Affiliation:
[email protected], University of Antwerp, EMAT, Groenenborgerlaan 171, Antwerp, B-2020, Belgium
Wilfried Vandervorst
Affiliation:
[email protected], IMEC, AMPS, Kapeldreef 75, Leuven, B-3001, Belgium
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Abstract

The potential use of carbon nanotubes (CNT) as interconnects requires also new characterization approaches as the existing ones are optimized for three-dimensional materials and do not work for inherently one-dimensional structures like CNTs. Therefore, we have developed a so-called pick-and-place process which allows to remove an individual CNT from a specific site and to place it at another location for further analysis. The approach is based on nanomanipulation combined with scanning electron microscopy (SEM). This paper presents the pick-and-place concept and explains the different steps required for its successful application. We further demonstrate its power by characterizing individual CNTs using transmission electron microscopy (TEM) and atomic force microscopy (AFM). The developed pick-and-place approach overcomes the challenge of site-specific analysis of CNT interconnects and strongly facilitates the routine analysis of CNTs.

Type
Research Article
Copyright
Copyright © Materials Research Society 2008

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References

1. Srivastava, N., Joshi, R.V., and Banerjee, K., IEDM (2005).Google Scholar
2. Li, H., Srivastava, N., Mao, J-F., Yin, W-Y., and Banerjee, K., IEDM (2007).Google Scholar
3. Hantschel, T., Niedermann, P., Trenkler, T., and Vandervorst, W., Appl. Phys. Lett. 76, 1603 (2000).Google Scholar
4. Williams, P. A., Papadakis, S. J., Falvo, M. R., Patel, A. M., Sinclair, M., Seeger, A., Helser, A., Taylor, R. M., Washburn, S., and Superfine, R., Appl. Phys. Lett. 80, 2574 (2002).Google Scholar
5. Brintlinger, T., Chen, Y., Durkop, T., Cobas, E., and Fuhrer, M. S., Appl. Phys. Lett. 81, 2454 (2002).Google Scholar
6. Esconjauregui, S., Whelan, C.M., and Maex, K., Nanotechnology 18, 015602 (2007).Google Scholar
7. Kuroda, M.A., Cangellaris, A., Leburton, J.-P., Phys. Rev. Lett. 95, 266803 (2005).Google Scholar