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Nanofluidic capillaries produced via femtosecond laser induced delamination of thin thermal oxide films from Si(100) substrates

Published online by Cambridge University Press:  26 February 2011

Joel Patrick McDonald
Affiliation:
[email protected], University of Michigan, Applied Physics, B121 Gerstacker Building, 2200 Bonisteel Ave., Ann Arbor, MI, 48109, United States, 734-647-9498
Vanita R. Mistry
Affiliation:
[email protected], University of Michigan, Mechanical Engineering, United States
Katherine E. Ray
Affiliation:
[email protected], University of Michigan, Electrical Engineering and Computer Science, United States
Steven M. Yalisove
Affiliation:
[email protected], University of Michigan, Materials Science and Engineering, United States
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Abstract

Highly selective and repeatable delamination of thermal oxide films from Si(100) substrates has been performed using single and multiple femtosecond laser pulses forming bubbles or blisters. By overlapping the bubbles laterally, tubes or capillaries can be formed with a range of volumes suitable for nanofluidics. By scanning the sample through the laser using an automated translation stage, patterns of tubes with arbitrary complexity can be formed, while the scan velocity can easily control the volume of the tubes. The production time for capillaries in this fashion is considerably less than with other lithographic techniques, while the proximity of the tubes to the underlying silicon substrate yields the possibility for integrated devices. The mechanism responsible for the delamination will be discussed and the optimal laser and sample translation conditions will be presented which provide the most uniform tubes. Atomic force microscopy and optical microscopy of capillaries with a range of volumes will be presented.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

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References

[1] McDonald, J. P., et al. , Applied Physics Letters, 86, art. no. 264103 (2005).Google Scholar
[2] McDonald, J. P., et al. , MRS Spring 2005 Proceedings, Symposium: Thin Films—Stresses and Mechanical Properties XI, Mater. Res. Soc. Symp. Proc. 875, O.12.Google Scholar
[3] Xiao, K., et al. , Applied Physics Letters, 85, p 1934 (2004).Google Scholar
[4] Moon, M. W., et al. , Acta Materiala, 52, p 3151, (2004).Google Scholar
[5] Mijatovic, D., et al. , Lab Chip, 5, p 492, (2005).Google Scholar