Hostname: page-component-586b7cd67f-g8jcs Total loading time: 0 Render date: 2024-11-28T02:27:31.799Z Has data issue: false hasContentIssue false

Nano and Macro Indentation Studies of Polycrystalline Copper Using Spherical Indenters

Published online by Cambridge University Press:  10 February 2011

Yong Yee Lim
Affiliation:
Cavendish Laboratory, Madingley Road, Cambridge CB3 OHE, UK
Andrew J Bushby
Affiliation:
Department of Materials, Queen Mary and Westfield College, University of London, London El 4NS, UK
M Munawar Chaudhri
Affiliation:
Cavendish Laboratory, Madingley Road, Cambridge CB3 OHE, UK
Get access

Abstract

Indentation studies of polycrystalline heavily work-hardened and annealed oxygen-free copper have been made using spherical indenters of radii 7, 35, 60, 200 and 500 μm. In the case of the 200 and 500 μm radii indenters an instron mechanical testing machine was used for applying the load, whereas for the smaller indenters a UMIS 2000 machine was used. It is shown that the relationship between the mean indentation pressure, Pm and a/R (i.e. indentation stress-strain), where a and R are the radii of the circle of contact and indenter, respectively, is independent of indenter radius, provided the indentation radius, a, is correctly measured. It is also shown that in the case of the work-hardened copper, the departure from the elastic behaviour occurs at Pm ≈ 1.1 Y, where Y is the uni-axial yield stress of the copper. In the case of the annealed copper, although the Pm vs a/R curve for the smallest indenter has the same form as for the 200 and 500 7mu;m radii indenters, the values of Pm, are higher by 50% over the enitre range of a/R. It is discussed that the spherical indentation hardness measurements, using micron-sized spherical indenters, provide a suitable method for estimating the yield stress of thin coatings and surfaces.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Wahlberg, A., J. Iron. Steel. Inst., 59, p. 243 (1901)Google Scholar
2. Meyer, E., Z. ver. deutsche. Ing., 54, p. 645 (1908)Google Scholar
3. Davies, R. M., Proc. Roy. Soc. A, 197, p. 416 (1949)Google Scholar
4. Ishlinsky, A. J., J. Appl. Math. Mech. (USSR), 8, p. 233 (1944)Google Scholar
5. Mesarovic, S. D. and Fleck, N. A., Proc. Roy. Soc., submitted (1998)Google Scholar
6. Krupkowski, A., Rev. Metall., 28, p. 641 (1931)Google Scholar
7. Swain, M. V. and Mencik, J., Thin Solid Films, 253, p. 204 (1994)Google Scholar
8. Oliver, W. C. and Pharr, G. M., J. Mater. Res., 7, p. 1564 (1992)Google Scholar
9. Field, J. S. and Swain, M. V., J. Mater. Res., 8, p. 297 (1993)Google Scholar
10. Chaudhri, M. M. and Winter, M., J. Phys. D:Appl. Phys., 21, p. 370 (1988)Google Scholar
11. Tabor, D., Proc. Roy. Soc. A, 192, p. 247 (1948)Google Scholar
12. Chaudhri, M M, Phil. Mag. A, 74, p. 1213 (1996)Google Scholar