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Multi-Layer Photopolymer Micromachining

Published online by Cambridge University Press:  01 February 2011

J. R. Huang
Affiliation:
GE Global Research Center, One Research Circle, Niskayuna, NY, 12309, USA
B. Bai
Affiliation:
Center for Thin Film Devices, Electronic Materials and Processing Research Laboratories, Department of Electrical Engineering, Pennsylvania State University, University Park, PA 16801, USA
J. Shaw
Affiliation:
GE Global Research Center, One Research Circle, Niskayuna, NY, 12309, USA
T. N. Jackson
Affiliation:
Center for Thin Film Devices, Electronic Materials and Processing Research Laboratories, Department of Electrical Engineering, Pennsylvania State University, University Park, PA 16801, USA
C. Y. Wei
Affiliation:
GE Global Research Center, One Research Circle, Niskayuna, NY, 12309, USA
V. Manivannan
Affiliation:
GE Global Research Center, One Research Circle, Niskayuna, NY, 12309, USA
K. Durocher
Affiliation:
GE Global Research Center, One Research Circle, Niskayuna, NY, 12309, USA
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Abstract

This paper presents a novel method to create and integrate micro-machined devices and high aspect-ratio (height-to-width ratio) microstructures in which the microstructures are built up using multiple layers of photopolymer film and/or viscous solution. Very high aspect-ratio 2-and 3-dimensional (2-D and 3-D) microstructures were constructed by stacking photo-imageable polymer films. Such films may be dry films applied by lamination or solution layers applied by bar coating, or doctor blade coating. Photolithography is used in both cases to define the microstructure. This additive process of thin-film micromachining facilitates high aspect-ratio microstructure fabrication. We have demonstrated structures of up to 12-layers comprising 2-D arrays of deep trenches (180 μm deep and 25 μm wide) and a 2-layer SU-8 micro-trench array with an aspect ratio up to 36 on glass substrates. Miniaturized structures of interconnected reservoirs as small as 50 μm × 50 μm × 15 μm (∼38 pico liter storage capacity) are also being fabricated, along with a novel 5-layer microfluidic channel array and a vacuum-infiltration process for fluid manipulation. This method has the potential to create functional large-area micro-devices at low-cost and with increased device flexibility, durability, prototyping speed, and reduced process complexity for applications in optoelectronics, integrated detectors, and bio-devices. The novel multi-layer photopolymer dry film and solution process also allows microstructures in micro-electro-mechanical systems (MEMS) to be built with ease and provides the functionality of MEMS integration with electronic devices and integrated circuits (ICs).

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

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References

[1] Ford, S. M., Davies, J., Kar, B., Qi, S. D., McWhorter, S., Soper, S. A., Malek, C. K., “Micromachining in Plastics using X-Ray Lithography for the Fabrication of Micro-Electrophoresis Devices”, ASME Transactions, Journal of Biomechanical Engineering, vol. 121, pp. 1321, Feb. 1999.Google Scholar
[2] Zahn, J. D., Gabriel, K. J., and Fedder, G., “A Direct Plasma Etch Approach to High Aspect Ratio Polymer Micromachining with Applications in BioMEMS and CMOS-MEMS, The 15th IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 137140, Jan. 2002.Google Scholar
[3] Park, J.-H., Davis, S., Yoon, Y.-K., Prausnitz, M., and Allen, M. G., “Micromachined Biodegradable Microstructures”, The 16th IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 371374, Jan. 2003.Google Scholar
[4] Chang, S.-P., Lee, J.-B., Allen, M. G., “Robust Capacitive Pressure Sensor Array”, Sensors and Actuators, A, vol. 101, pp. 231238, 2002.Google Scholar
[5] Mills, D. M., Smith, L. S., “Real-Time In-Vivo Imaging with Capacitive Micromachined Ultrasound Transducer (cMUT) Linear Arrays”, IEEE Symposium on Ultrasonics, vol. 1, pp. 568571, Oct. 2003.Google Scholar
[6] Soper, S. A., Ford, S. M., Qi, S., McCarley, R. L., Kelly, K., Murphy, M., “Polymetric Microelectromechanical Systems”, ACS Analytical Chemistry, pp. 643 A-651 A, Oct. 2000.Google Scholar
[7] Brenner, K.-H., Kufner, M., Kufner, S., Moisel, J., Muller, A., Sinzinger, S., Testorf, M., Gottert, J., and Mohr, J., “Application of Three-Dimensional Micro-Optical Components formed by Lithography, Electroforming, and Plastic Molding”, Applied Optics, vol. 32, no. 32, pp. 64646469, Nov. 1993.Google Scholar
[8] Chang-Hasnain, C. J., “Widely Tunable VCSEL using Micromechanical Structures”, Extended Abstracts of the 1998 International Conference on Solid State Devices and Materials, Hiroshima, pp. 334335, 1998.Google Scholar
[9] Maruo, S., Ikuta, K., and Ninagawa, T., “Multi-Polymer Microstereolithography for Hybrid Opto-MEMS”, The 14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 151154, Jan. 2001.Google Scholar
[10] Chu, P. B., Lee, S.-S., and Park, S., “MEMS: the Path to Large Optical Crossconnects”, IEEE Communications Magazine, pp. 8087, Mar 2002.Google Scholar
[11] Ahn, C. H., Choi, J.-W., Beaucage, G., Nevin, J. H., Lee, J.-B., Puntambekar, A., and Lee, J. Y., “Disposable Smart Lab on a Chip for Point-of-Care Clinical Diagnostics”, Proceedings of the IEEE, vol. 92, iss. 1, pp. 154173, Jan. 2004.Google Scholar
[12] Chang, W. C., Lee, L. P., and Liepmann, D., “Adhesion-Based Capture and Separation of Cells for Microfluidic Devices,” Material Research Society Symposium Proceedings, vol. 729, pp. 155160, 2002.Google Scholar
[13] Mastrangelo, C. H. and Saloka, G. S., “A Dry-Release Method Based on Polymer Columns for Microstructure Fabrication”, IEEE Proceedings of Micro Electro Mechanical Systems (MEMS) - An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems, pp. 7781, Feb. 1993.Google Scholar
[14] Fedder, G. K., Santhanam, S., Reed, M. L., Eagle, S. C., Guillou, D. F., Lu, M. S.-C., and Carley, L. R., “Laminated High-Aspect-Ratio Microstructures in a Conventional CMOS Process”, The 9th Annual International Workshop on Micro Electro Mechanical Systems (MEMS), pp. 1318, Feb. 1996.Google Scholar
[15] Bhusari, D., Reed, H. A., Wedlake, M., Padovani, A. M., Allen, S. A. B., and Kohl, P. A., “Fabrication of Air-Channel Structures for Microfluidic, Microelectromechanical, and Microelectronic Applications”, Journal of Microelectromechanical Systems, vol. 10, no. 3, pp. 400408, 2001.Google Scholar
[16] Wilhelm, E. J. and Jacobson, J. M., “Direct Printing of Nanoparticles and Spin-on-Glass by Offset Liquid Embossing,” Applied Physics Letters, vol. 84, no. 18, pp. 35073509, 2004.Google Scholar
[17] Narasimhan, J and Papautsky, I, “Polymer Embossing Tools for Rapid Prototyping of Plastic Microfluidic Devices,” Journal of Micomechanics and Microengineering, vol. 14, pp. 96103, 2004.Google Scholar
[18] Zara, J., and Smith, S. W., “A Micromachine High Frequency Ultrasound Scanner using Photolithographic Fabrication”, IEEE Transactions on Ultrasonics, Feroelectrics, and Frequency Control, vol. 49, no. 7, pp. 947958, July 2002.Google Scholar
[19] Flack, W., Fan, W., and White, S., “Optimization and Characterization of Ultrathick Photoresist Films”, Proceeding of SPIE, vol. 3333, pp. 12881303, 1998.Google Scholar
[20] Lorenz, H., Laudon, M., and renaud, P., “Mechanical characterization of a New High-Aspect-Ratio Near UV-Photoresist”, Microelec. Eng., 41/42, pp. 371374, 1998.Google Scholar
[21] Eyre, B., Blosiu, J., and Wiberg, D., “Taguchi Optimization for the Processing Epon SU-8 Resist”, IEEE Proceeding of MEMS, Heidelberg, pp. 1823, 1998.Google Scholar
[22] Ling, Z-E, et al, “Improved Patterning Quality of SU8 Microstructures by Optimizing the Exposure Parameters”, Proceeding of SPIE, pp. 3999, 2000.Google Scholar
[23] Feng, R., et al., “Influence of Processing Conditions on the Thermal and Mechnical Properties of SU8 Negative Photoresist Coatings”, J. Micromech Microeng, pp. 13, 2003.Google Scholar
[24] Stjernstrom, M. and Roeraade, J., “Method for Fabrication of Microfluidic Systems in Glass,” Journal of Micromechanics and Microengineering, vol. 8, pp. 3338, 1998.Google Scholar
[25] Sammarco, T. S. and Burns, M. A., “Thermocapillary Pumping of Discrete Drops in Microfabricated Analysis Devices,” AIChE Journal - Reactors, Kinetics, and Catalysis, vol. 45, no. 2, pp. 350366, 1999.Google Scholar
[26] Huang, J.R., Qian, W., Klauk, H., Jackson, T.N., Black, K., Deines-Jones, P., and Hunter, S.D., “Active-Matrix Pixelized Well Detectors on Polymeric Substrates”, Proceedings of the 51st IEEE National Aerospace and Electronics Conference (NAECON), pp. 476482, 2000.Google Scholar