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Modeling the Effects of Polishing Pressure and Speed on CMP Rates

Published online by Cambridge University Press:  18 March 2011

Ed Paul
Ed Paul*
Affiliation:
Stockton College, Pomona NJ 08240
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Abstract

In a previous CMP model, the effects of the slurry concentration of chemicals and abrasives on the polishing rate were quantitatively explained, for constant polishing pressure and velocity. That model is extended here to consider specific descriptions of mechanical abrasion, involving polishing pressures and speeds. Predictions of behavior are compared to literature data, leading to an improved understanding of the abrasive process in CMP.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 671: Symposium M – Chemical-Mechanical Polishing 2001–Advances and Future Challenges , 2001 , M4.8
Copyright
Copyright © Materials Research Society 2001

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References

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