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Modeling and Experimental Study of SiH4/GeH4/H2 Gas Discharge for Hydrogenated Silicon Germanium Deposition by RF PECVD

Published online by Cambridge University Press:  10 May 2012

Lai Zhao ,
Robert Hunsperger  and
Steven Hegedus
Lai Zhao
Affiliation:
Department of Electrical and Computer Engineering, University of Delaware, 140, Evans Hall, Newark, DE, 19716, U.S.A.
Robert Hunsperger
Affiliation:
Department of Electrical and Computer Engineering, University of Delaware, 140, Evans Hall, Newark, DE, 19716, U.S.A.
Steven Hegedus
Affiliation:
Institute of Energy Conversion, 451 Wyoming Road, Newark, DE 19716, U.S.A
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Abstract

A one-dimensional model has been developed for radio frequency (RF) glow discharge of SiH4/GeH4/H2 3-gases mixture at a high pressure regime based on the fluid model. The behavior of electrons, neutrals, radicals and ions with corresponding rate constants is described by driftdiffusion equations that are coupled with the Poisson’s equation and solved with an explicit central-difference discretization scheme. The germanium (Ge) content in the deposited film and germane (GeH4) radical fraction in the gas phase are found to decrease as total gas pressure increases in contrast to the increased deposition rate, which are explained by the fact that GeHx-group species are more thoroughly depleted and less promoted by the denser plasma at high pressure compared to SiHx-group species. The multiplied population of electrons and hydrogen atoms in the quadratically denser plasma also boosts secondary reactions which are favorable for SiH3 and GeH3 and consume SiH2 and GeH2for high order radicals.

Keywords

plasma-enhanced CVD (PECVD) (chemical reaction)simulationGe
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1426: Symposium A – Amorphous and Polycrystalline Thin-Film Silicon Science and Technology–2012 , 2012 , pp. 403 - 408
Copyright
Copyright © Materials Research Society 2012

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