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Microthermomechanical Analysis of Lead-Free SN-3.9AG-0.6CU Alloys; Part I : Viscoplastic Constitutive Properties

Published online by Cambridge University Press:  21 March 2011

Peter Haswell  and
Abhijit Dasgupta
Peter Haswell
Affiliation:
CALCE Electronic Products and Systems Center University of Maryland, College Park, MD 20742, USA
Abhijit Dasgupta
Affiliation:
CALCE Electronic Products and Systems Center University of Maryland, College Park, MD 20742, USA
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Abstract

This is part I of a two-part paper on the mechanical behavior of lead-free solders. The constitutive properties of Sn3.9Ag0.6Cu lead-free alloy are presented and compared against baseline data from eutectic Sn63Pb37 solder. Monotonic, displacement-controlled and load-controlled tests are performed over various temperatures, strain rates and stresses using the thermo-mechanical-microstructural (TMM) test system. It is shown that the lead-free alloy exhibits creep strain rates that are from one to five orders of magnitude lower than the eutectic SnPb alloy, depending on the stress level and the homologous temperature.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 682: Symposium N – Microelectronics and Microsystems Packaging , 2001 , N2.1
Copyright
Copyright © Materials Research Society 2001

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References

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