Hostname: page-component-745bb68f8f-cphqk Total loading time: 0 Render date: 2025-01-27T02:32:17.931Z Has data issue: false hasContentIssue false
  • English
  • Français

Microstructural Observations and Mechanical Behavior of Pb-Sn Solder on Copper Plates

Published online by Cambridge University Press:  25 February 2011

Darrel Frear ,
Dennis Grivas ,
Lenora Quan  and
J. W. Morris Jr.
Darrel Frear
Affiliation:
Center for Advanced Materials, Lawrence Berkeley Laboratory University of California, Berkeley, CA 94720
Dennis Grivas
Affiliation:
Center for Advanced Materials, Lawrence Berkeley Laboratory University of California, Berkeley, CA 94720
Lenora Quan
Affiliation:
Center for Advanced Materials, Lawrence Berkeley Laboratory University of California, Berkeley, CA 94720
J. W. Morris Jr.
Affiliation:
Center for Advanced Materials, Lawrence Berkeley Laboratory University of California, Berkeley, CA 94720
Get access

Abstract

The microstructure and mechanical properties of Pb-Sn solder joining Cu plates were studied. Yticrostructural observations were made on both the bulk Pb-Sn solder and on the interface between the solder and Cu plates. Pb-Sn solder has a two-phase microstructure in which the Pb-rich phase is the weaker. β-Sn precipitates in the Pb-rich phase were characterized in TEM. Intermetallic phases (Cu6 Sn5 and Cu3Sn) that form during the reaction of molten Pb-Sn solder with Cu were investigated. Solder joints were tested to fracture in both shear and tensile configurations. The mechanical properties and fracture surface characteristics are reported.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 72: Symposium G – Electronic Packaging Materials Science II , 1986 , 181
Copyright
Copyright © Materials Research Society 1986

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Kang, S., Zommer, N., Feucht, D., Heckle, R., IEEE PHP–13, 318 (1977).Google Scholar
2. Rathore, H., Yih, R., Edenfeld, A., J. Testing and Eval. 1973, 170.Google Scholar
3. Bangs, E., Beal, R., Welding Res. Supp. 1975, 377s.Google Scholar
4. Darrel, Frear,Morris, J. W. Jr., Proc. 43rd Annual Meeting of Electron Microscopy Society of America 1985, 342.CrossRefGoogle Scholar
5. Grivas, D., PhD thesis, University of California, Berkeley, 1978.Google Scholar
6. Kawakatsu, I., Osawa, I., Yamaguchi, H., Trans. JIM 13, 436 (1972).CrossRefGoogle Scholar
7. Kay, P., MacKay, C., Trans. Inst. Met. Fin. 54, 68 (1976).CrossRefGoogle Scholar
8. Tu, K., Acta Met. 21, 34 (1973).CrossRefGoogle Scholar
9. Blum, P., Pelissier, J., Silvestre, G., Solid State Tech. 1973, 55.Google Scholar
10. Quan, L., Frear, D., Grivas, D., Morris, J. W., presented at the 1986 AIME Spring Meeting, New Orleans, LA, 1986 (unpublished).Google Scholar