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Microscratci I Test on Carbon Films as Thin as 20 nm

Published online by Cambridge University Press:  16 February 2011

T. W. Wu
Affiliation:
IBM Research Division, Almaden Research Center, San Jose, CA 95120.
A. L. shull
Affiliation:
IBM Research Division, Almaden Research Center, San Jose, CA 95120.
J. Lin
Affiliation:
IBM Research Division, Almaden Research Center, San Jose, CA 95120.
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Abstract

The capabilities to monitor tangential force and acoustic emission have been added to the microscratch mode of the IBM microindenter. These two new monitoring devices combined with the existing normal loadcell enhance the ability of the microscratch test to measure mechanical properties of thin film materials. As a demonstration of the upgraded microindenter, scratch tests were performed on 11 0nm and 20nm thick carbon films deposited on Si <100> substrates. The scratch morphology was examined by scanning electron microscopy to correlate the mechanical data to corresponding failure mechanisms.

In the case of the 110nm film, a brittle type fracture was taking place as the applied normal load exceeded a critical value. All three monitored outputs detected the first occurrence of the spallation ofthe film. In contrast to the thicker film, large scale spallation was not observed for thle 20nm film, and the acoustic emission detector did not show any significant output. An apparent friction coefficient(FR) is defined as the ratio ofthe tangential force to the normal load. FR is determined to be a useful parameter for monitoring the indenter's transition through the coating into the substrate, particularly in the case of small scale fracturing or simple ploughing through types of failure.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

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References

REFERENCES

1. Wu, I. T.W., Hlwang, C., Lo, J. and Alexopoulos, P.S., Thin Solid Films, 166, 299308 (1988); IBM Research Report, RJ 6159 60869,(1988)Google Scholar
2. Wu, T.W., Burn, R.A., Chen, M. M. and Alexopoulos, P.S. in Thin Films: Stresses and Mechanical Properties edited by Bravman, J.C., Nix, W.D., Barnett, D.M. and Smithi, D.A. (Mat. Kes. Soc. Proc. 130, Pittsburgh, PA 1989) pp. 117122.Google Scholar
3. Wu, T.W., Moshref, M., Alexopoulos, P.S., to be published in Thin Solid Films, Section B, 1990; IBM Research Report, RJ 6768 64836, 1989).Google Scholar
4. Wu, T.W., to be presented at the-1990 M RS Spring Meeting, San Francisco, CA.Google Scholar
5. Wu, T.W., Shull, A.L. and Berriche, R., in preparation.Google Scholar
6. Steinmann, P.A., Tardy, Y. and Hintermann, I.E., Thin Solids Films 154,333 (1987).Google Scholar
7. Valli, J., Makela, U. and Matthews, A., Surf. Eng. 2, 49 (1986).Google Scholar
8. Perry, A.J., Surf. Eng. 2, 183 (1986).Google Scholar
9. Lawn, B.R. and Wilshaw, R., J. Mater. Sci. 10,1049 (1975).Google Scholar
10. Hamilton, G.M. and Goodman, L.E. J Mater. Sci. 33,371 (1966).Google Scholar
11. O'Sullivan, T.C. and King, R.B., J. Trb. 110,235 (1988): IBM Research Report, RJ 5363 55072, (1986).Google Scholar