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Metal-Organic Chemical Vapor Deposition (MOCVD) of GeSbTe-based Chalcogenide Thin Films

Published online by Cambridge University Press:  01 February 2011

Gary S. Tompa
Affiliation:
[email protected], Structured Materials Ind., Inc., 201 Circle Drive N, Unit 102, Piscataway, NJ, 08854, United States
Shangzhu Sun
Affiliation:
[email protected], Structured Materials Ind., Inc., 201 Circle Drive N., Unit 102, Piscataway, NJ, 08854, United States
Catherine E Rice
Affiliation:
[email protected], Structured Materials Ind., Inc., 201 Circle Drive N., Unit 102, Piscataway, NJ, 08854, United States
Joe Cuchiaro
Affiliation:
[email protected], Structured Materials Ind., Inc., 201 Circle Drive N., Unit 102, Piscataway, NJ, 08854, United States
Edwin Dons
Affiliation:
[email protected], Structured Materials Ind., Inc., , 201 Ci rcle Drive N., Unit 102, Piscataway, NJ, 08854, United States
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Abstract

Chalcogenide Random Access Memory (C-RAM) has shown significant promise in combining the desired attributes of an ideal memory, including: nonvolatility, fast read/write/erase speed, low read/write/erase voltage/power, high endurance, and radiation hardness. Current C-RAM production technology relies on sputtering to deposit the active chalcogenide layer. The sputtering process leads to difficulties in meeting requirements for device conformality (in particular – filling vias), film adherence, compositional control, wafer yield, and surface damage. Ultimately, a viable CVD manufacturing process is needed for high-density products to realize the full potential of C-RAM. In this work, we discuss the Metal-Organic Chemical Vapor Deposition (MOCVD) tool technology used to produce the films and report the materials properties of GeSbTe-based chalcogenide thin films grown in small research scale and in large production scale MOCVD reactors. Films were grown at low pressures at temperatures ranging from 350 C to 600 C. X-Ray Fluorescence (XRF) and Auger Electron Spectroscopy (AES) were performed and determined that the film composition is controllable and uniform.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

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References

2 Originating USA patents: 3.271,591, Ovshinski, S. R., 1966 and 3,448,302, D. J. Shanefield, 1969Google Scholar
3 , Nonaka, Ohbayashi, G., Toriumi, Y., Mori, Y., and Hashimoto, H., Thin Solid Films 370, 258 (2000)Google Scholar
4PCT/US06/46524, Dons, E. M., Tompa, G. S., Rice, C. E., and Cuchiaro, J.D., 2005 priority.Google Scholar