Hostname: page-component-586b7cd67f-dsjbd Total loading time: 0 Render date: 2024-11-25T03:53:42.869Z Has data issue: false hasContentIssue false

Metal Transport and Loss in Hafnium and Lanthanum Aluminate Films on Si Hampered by Thermal Nitridation

Published online by Cambridge University Press:  01 February 2011

Leonardo Miotti
Affiliation:
[email protected], Universidade Federal do Rio Grande do Sul, Instituto de Física, Av. Bento Gonçalves, 9500, Porto Alegre, RS, 91509-900, Brazil, 55 51 33166485, 55 51 33166510
Carlos Driemeier
Affiliation:
[email protected], Universidade Federal do Rio Grande do Sul, Instituto de Física, Av. Bento Gonçalves, 9500, Porto Alegre, RS, 91509-900, Brazil
Felipe Tatsch
Affiliation:
[email protected], Universidade Federal do Rio Grande do Sul, Instituto de Física, Av. Bento Gonçalves, 9500, Porto Alegre, RS, 91509-900, Brazil
Cláudio Radtke
Affiliation:
[email protected], Universidade Federal do Rio Grande do Sul, Pós-Graduação em Microeletrônica, Av. Bento Gonçalves, 9500, Porto Alegre, RS, 91509-900, Brazil
Israel Jacob Rabin Baumvol
Affiliation:
[email protected], CCET and Universidade Federal do Rio Grande do Sul, Instituto de Física, Av. Bento Gonçalves, 9500, Porto Alegre, RS, 91509-900, Brazil
Edon Vincent
Affiliation:
[email protected], Université Paris Sud, Laboratoire de Physique des Gaz et des Plasmas, Orsay, N/A, 91405, France
Marie Christine Hugon
Affiliation:
[email protected], Université Paris Sud, Laboratoire de Physique des Gaz et des Plasmas, Orsay, N/A, 91405, France
Bernard Agius
Affiliation:
[email protected], Université Paris Sud, Laboratoire de Physique des Gaz et des Plasmas, Orsay, N/A, 91405, France
Get access

Abstract

The effects on metal transport and loss in Hf and La aluminate films deposited on Si induced by rapid thermal annealing at 1000°C were investigated. Decomposition of HfAlO films on Si during rapid thermal annealing was reveled by the decrease of the Hf and Al contents. Metal loss from LaAlO/Si structures was also observed following annealing in vacuum, while strong metal transport and interfacial reaction were induced by annealing in a O2 containing atmosphere. These instabilities were hampered by means of post deposition thermal nitridation in NH3 at temperatures lower than 1000°C performed before the rapid thermal annealing step. The role of nitridation is discussed in terms of the N profiles in the nitrided structures.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] The International Technology Roadmap for Semiconductors, Semiconductor Industry Association, 2004 Update (http://public.itrs.net/).Google Scholar
[2] Hubbardand, K. J. Schlom, D. G., J. Mat. Res. 11, 2757 (1996).Google Scholar
[3] Houssa, M., High-k Dielectrics, (Institute of Physics Publishing Ltd., London, 2004).Google Scholar
[4] Park, M., Koo, J., Kim, J., Jeon, H., Bae, C., and Krug, C., Appl. Phys. Lett. 86, 252110 (2005).Google Scholar
[5] Cho, M. -H., Chung, K. B., Chang, H. S., Moon, D. W., Park, S. A., Kim, Y. K., Jeong, K., Whang, C. N., Whang, D. W., Lee, D. W., Ko, D. –H., Doh, S. J., Lee, J. H., and Lee, N. I., Appl. Phys. Lett. 85, 4115 (2004).Google Scholar
[6] Monaghan, S., Greer, J. C., and Elliotta, S. D., J. App. Phys. 97, 114911 (2005).Google Scholar
[7] Yang, Y., Zhu, W., Ma, T. P., and Stemmer, S., J. Appl. Phys. 95, 3772 (2004).Google Scholar
[8] Chang, J. P. and Lin, Y.-S., Appl. Phys. Lett. 79, 3824 (2001).Google Scholar
[9] Cho, M.-H., Chang, H. S., Cho, Y. J., Moon, D. W., Min, K.-H., Sinclair, R., Kang, S. K., Ko, D.-H., Lee, J. H., Gu, J. H., and Lee, N. I., Appl. Phys. Lett. 84, 571 (2004).Google Scholar
[10] Nguyen, N.V., Sayan, S., Baumvol, I. J. R., Driemeier, C., Krug, C., Wielunski, L., and Diebold, A., J. Vac. Sci. Technol. A 23, 1706 (2005).Google Scholar
[11] Copel, M., Gribelyuk, M., and Gusev, E., Appl. Phys. Lett. 76, 436 (2000).Google Scholar
[12] Miotti, L., P, K.. Bastos, Driemeier, C., Edon, V., Hugon, M. C., Agius, B., and Baumvol, I. J. R., Appl. Phys. Lett. 87, 022901 (2005).Google Scholar
[13] Amsel, G., Nadai, J.P., D'Artemare, E., David, D., Girard, E., Moulin, J., Nucl. Instr. Meth. 92, 481 (1971).Google Scholar
[14] Baumvol, I. J. R., Surf. Sci. Rep. 36, 1 (1999) and references therein.Google Scholar
[15] Gusev, E. P., Copel, M. C., Cartier, E., Baumvol, I. J. R., Krug, C., Gribelyuk, M. A., Appl. Phys. Lett. 76, 176 (2000).Google Scholar
[16] Feldman, L. C., Silverman, P. J., Williams, J. S., Jackman, T. E., and Stensgaard, I., Phys. Rev. Lett. 41, 1396 (1978).Google Scholar
[17] Pezzi, R. P., Copel, M., Cabral, C., and Baumvol, I. J. R., Appl. Phys. Lett. 87, 162902 (2005).Google Scholar
[18] Wang, J., Lim, P. C., Huan, A. C. H., Liu, C. L., Chai, J. W., Chow, S. Y., Pan, J. S., Li, Q., and Ong, C. K., Appl. Phys. Lett. 82, 2047 (2003).Google Scholar