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Mechanisms of Passivation of Copper in CMP Slurries Containing Peroxide and Glycine

Published online by Cambridge University Press:  01 February 2011

Ling Wang  and
Fiona M. Doyle
Ling Wang
Affiliation:
University of California at BerkeleyDepartment of Materials Science and Engineering 210 Hearst Mining Building Berkeley, CA 94720-1760
Fiona M. Doyle
Affiliation:
University of California at BerkeleyDepartment of Materials Science and Engineering 210 Hearst Mining Building Berkeley, CA 94720-1760
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Abstract

Copper has been observed to passivate in CMP slurries containing glycine, when hydrogen peroxide is used as an oxidant, even under acidic conditions where no solid oxidized phases appear on the potential-pH diagram. This passivation behavior is highly desirable for effective CMP. In contrast, passivation is not seen in slurries of similar pH and complexing agent concentration, where the potential is increased electrochemically. In order to model the effects of chemistry on CMP rates, we are endeavoring to better understand the mechanisms responsible for passivation in slurries containing hydrogen peroxide. Here we report tests that characterize the development and degree of passivation seen in slurries with a reasonably wide range of compositions.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 767: Symposium F – Chemical-Mechanical Planarization , 2003 , F6.5
Copyright
Copyright © Materials Research Society 2003

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