Hostname: page-component-586b7cd67f-rdxmf Total loading time: 0 Render date: 2024-11-28T11:22:09.020Z Has data issue: false hasContentIssue false
  • English
  • Français

Mechanical Testing of Free-Standing Thin Films

Published online by Cambridge University Press:  15 March 2011

W. N. Sharpe Jr.  and
K. J. Hemker
W. N. Sharpe Jr.
Affiliation:
Department of Mechanical Engineering, Johns Hopkins University, Baltimore, MD 21218
K. J. Hemker
Affiliation:
Department of Mechanical Engineering, Johns Hopkins University, Baltimore, MD 21218
Get access

Abstract

An overview is given of methods for testing thin-film tensile specimens of either MEMS materials or surface coatings. MEMS specimens are deposited in a final shape and need only to be released for testing, while specimens of coating materials must be extracted. Very brief descriptions of the specimen designs, force application approaches, and strain measurements are given along with a limited number of references. Representative stress-strain curves for polysilicon, silicon nitride, silicon carbide, electroplated nickel and diffusion aluminide bond coating are presented. Results at high temperatures are presented for the latter two materials.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 687: Symposium B – Materials Science of Microel ectromechanical Systems (MEMS) Devices IV , 2001 , B10.6/P6.6
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Hollman, P., Alahelisten, A., Olsson, M., and Hogmark, S., Thin Solid Films, 270, 137–142 (1995).Google Scholar
2. Jones, P. T., Johnson, G. C., and Howe, R. T., ASME DSC 59, 325–330 (1996).Google Scholar
3. Biebl, M., Brandl, G., and Howe, R. T., Transducers ' 95, 80–83 (1995).Google Scholar
4. Vlassak, J. J. and Nix, W. D., J. Materials Research 7, 3242–3249 (1992).Google Scholar
5. Kobrinsky, M., Deutsch, E., and Senturia, S., MEMS 1, ASME, 3–10, (1999).Google Scholar
6. Jensen, B. D., Boer, M. P. De, Masters, N. D., Bitsie, F., and LaVan, D. A., J. Microelectromechanical Systems, 10, 336–346 (2001).Google Scholar
7. Tsuchiya, T., Tabata, O., Sakata, J., and Taga, Y., Proc. IEEE Tenth Annual International Workshop on MEMS, 529–534, (1997).Google Scholar
8. Sharpe, W. N. Jr., Yuan, B., and Edwards, R. L., J. Microelectromechanical Systems 6, 193–199, (1997).Google Scholar
9. Sharpe, W. N. Jr., The MEMS Handbook, CRC Press, 3-1 to 3-33, (2001).Google Scholar
10. Yu, M. F., Lourie, O., Dyer, M. J., Moloni, K., Kelly, T. F., and Ruoff, R. S., Science 287, 637–40 (2000).Google Scholar
11. Sharpe, W. N. Jr., Danley, D., and LaVan, D. A., Small Specimen Test Techniques, ASTM STP 1329, 497–512 (1998).Google Scholar
12. Sharpe, W. N. Jr., and McAleavey, A., Proc. SPIE, 3512, (1998).Google Scholar
13. Read, D. T. and Dally, J. W., J. Materials Research 8, 1542–1549 (1992).Google Scholar
14. Brown, S. B., Edwards, R. L., Panth, R., Bergstrom, J., Coles, G., and Sharpe, W. N. Jr., MRS Symposium B, B9.2, (2001).Google Scholar
15. Sharpe, W. N. Jr., Eby, M.A., and Coles, G., Proc. Transducers ' 01, 1366–1369 (2001).Google Scholar
16. LaVan, D. A., Tsuchiya, T., Coles, G., Knauss, W. G., Chasiotis, I., and Read, D., Mechanical Properties of Structural Films, ASTM STP 1413, (2001).Google Scholar
17. Sharpe, W. N. Jr., Turner, K. T., and Edwards, R. L., Exp. Mechanics 39, 162–170 (1999).Google Scholar
18. Kapels, H., Urscher, J., Aigner, R., Sattler, R., Wachutka, G., and Binder, J., Eurosensors XIII, 12B 1, 379–382 (1999).Google Scholar
19. Haque, M. A. and Saif, M. T. A., Proc. Transducers' 01, 1374–1377 (2001).Google Scholar
20. Cornella, G., Vinci, R. P., Iyer, R. S., Dauskardt, R. H., and Bravman, J. C., Mat. Res. Soc. Symp. Proc., 518, 81–86 (1998).Google Scholar
21. Sharpe, W. N. Jr., NASA Technical Memorandum 101638, (1989).Google Scholar
22. Bucheit, T., Glass, S., VaVan, D., Mani, S., Friedmann, T., and Sullivan, J., ASME IMECE, MAT-8, (2001).Google Scholar
23. Chasiotis, I. and Knauss, W. G., Proc. Society for Experimental Mechanics, 56–61, (2000).Google Scholar
24. Hemker, K. J., Cho, H. S., Desta, Y., Lian, K., and Goettert, J., J. Microsystem Tech., in press (2001).Google Scholar
25. Pan, D., Glynn, M., Chen, M., and Hemker, K.J., Creep Deformation: Fundamentals and Applications, Eds. Mishra, R.S., Earthman, J.C. and Raj, S.V., TMS Publications, in press, (2001).Google Scholar