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Low-Temperature Photosensitive Polyimide Processing for Use in 3D Integration Technologies

Published online by Cambridge University Press:  03 June 2014

Frank Windrich ,
Mikhail Malanin ,
Klaus J. Eichhorn ,
Brigitte Voit  and
Klaus D. Lang
Frank Windrich
Affiliation:
Center “All Silicon System Integration Dresden”, Fraunhofer IZM, Moritzburg, Germany Organic Chemistry of Polymers, Technische Universität Dresden, Dresden, Germany
Mikhail Malanin
Affiliation:
Leibniz-Institut für Polymerforschung Dresden e.V., Dresden, Germany
Klaus J. Eichhorn
Affiliation:
Leibniz-Institut für Polymerforschung Dresden e.V., Dresden, Germany
Brigitte Voit
Affiliation:
Leibniz-Institut für Polymerforschung Dresden e.V., Dresden, Germany Organic Chemistry of Polymers, Technische Universität Dresden, Dresden, Germany
Klaus D. Lang
Affiliation:
Center “All Silicon System Integration Dresden”, Fraunhofer IZM, Moritzburg, Germany
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Keywords

polymerkineticsmicroelectronics
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1692: Symposium CC – New Materials and Processes for Interconnects, Novel Memory and Advanced Display Technologies , 2014 , mrss14-1692-cc06-02
Copyright
Copyright © Materials Research Society 2014 

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References

REFERENCES

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Russell, J. D., Kardos, J. L., “ Modeling the imidization kinetics of AFR700B polyimide ”, Polymer Composites, 18, pp. 64–78, (1997)CrossRefGoogle Scholar