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Low Temperature Plasma Etching of Copper for Minimizing Size Effects in sub-100 nm Features

Published online by Cambridge University Press:  01 February 2011

Nagraj S Kulkarni ,
Prabhakar Tamirisa ,
Galit Levitin ,
Richard J Kasica  and
Dennis W Hess
Nagraj S Kulkarni
Affiliation:
[email protected], Oak Ridge National Laboratory, Materials Science & Technology, 1 Bethel Valley Road, P.O. Box 2008, MS-6063, Oak Ridge, TN, 37831-6063, United States
Prabhakar Tamirisa
Affiliation:
[email protected], Georgia Institute of Technology, School of Chemical and Biomolecular Engineering, 311 Ferst Drive, N.W., Atlanta, Georgia, 30332-0100, United States
Galit Levitin
Affiliation:
[email protected], Georgia Institute of Technology, School of Chemical and Biomolecular Engineering, 311 Ferst Drive, N.W., Atlanta, Georgia, 30332-0100, United States
Richard J Kasica
Affiliation:
[email protected], Oak Ridge National Laboratory, Oak Ridge, TN, 37831, United States
Dennis W Hess
Affiliation:
[email protected], Georgia Institute of Technology, School of Chemical and Biomolecular Engineering, 311 Ferst Drive, N.W., Atlanta, Georgia, 30332-0100, United States
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Abstract

A low temperature plasma etching process for patterning copper interconnects is proposed as a solution to the size effect issue in the resistivity of copper. Key features of this etching process based on a previous thermochemical analysis of the Cu-Cl-H system are discussed. Potential benefits of a subtractive etching scheme based on this process in comparison with the damascene scheme for copper-based interconnect processing in sub-100 nm features are presented in the context of the ITRS roadmap. Preliminary experimental work on plasma etching of Cu thin films using the proposed process is discussed.

Keywords

Cureactive ion etchingfilm
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 914: Symposium F – Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects , 2006 , 0914-F09-08
Copyright
Copyright © Materials Research Society 2006

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References

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