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Kinetic analysis and correlation with residual stress of the Ni/Si system in thin film

Published online by Cambridge University Press:  01 February 2011

F. Cacho ,
D. Aime ,
F. Wacquant ,
B. Froment ,
C. Rivero ,
P. Gergaud ,
O. Thomas ,
G. Cailletaud ,
H. Jaouen  and
S. Minoret
...Show all authors
F. Cacho
Affiliation:
Centre des Matériaux P.M. FOURT, Ecole des Mines de Paris, B.P. 87, 91003 Evry, France STMicroelectronics, 850 rue Jean Monet, 38921 Crolles, France
D. Aime
Affiliation:
STMicroelectronics, 850 rue Jean Monet, 38921 Crolles, France Laboratoire de Physique de la Matiére (LPM), INSA Lyon, 69621 Villeurbanne, France
F. Wacquant
Affiliation:
STMicroelectronics, 850 rue Jean Monet, 38921 Crolles, France
B. Froment
Affiliation:
STMicroelectronics, 850 rue Jean Monet, 38921 Crolles, France
C. Rivero
Affiliation:
TECSEN, UMR CNRS 6122, Univ. Aix-Marseille III, F-13397 Marseille Cedex 20, [email protected]
P. Gergaud
Affiliation:
TECSEN, UMR CNRS 6122, Univ. Aix-Marseille III, F-13397 Marseille Cedex 20, [email protected]
O. Thomas
Affiliation:
TECSEN, UMR CNRS 6122, Univ. Aix-Marseille III, F-13397 Marseille Cedex 20, [email protected]
G. Cailletaud
Affiliation:
Centre des Matériaux P.M. FOURT, Ecole des Mines de Paris, B.P. 87, 91003 Evry, France
H. Jaouen
Affiliation:
STMicroelectronics, 850 rue Jean Monet, 38921 Crolles, France
S. Minoret
Affiliation:
CEA-LETI, 17 rue des Martyrs, 38100 Grenoble, France
A. Souifi
Affiliation:
Laboratoire de Physique de la Matiére (LPM), INSA Lyon, 69621 Villeurbanne, France
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Abstract

Reactive diffusion of the Ni/Si system has been studied by annealing nickel thin film on (100) silicon crystal. The measurement of the NiSi sheet resistance as a function of the annealing temperature and the type of annealing (Rapid Thermal Annealing and spike one) has been investigated. A kinetic model based on multiphase diffusion has been developed that fits experimental sheet resistance data. Residual stress in the thin film, measured by a curvature measurement technique, is correlated with the nature of the phases in the film. Finally the viscoplastic mechanical behavior of the Ni2Si and NiSi phases is analyzed in the case of low and fast thermal ramps.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 875: Symposium O – Thin Films - Stresses and Mechanical Properties XI , 2005 , O14.5
Copyright
Copyright © Materials Research Society 2005

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References

1 Ng, K. and Lynch, W.T., IEEE Trans. Electron. Devices ED-34 (1987) 503 Google Scholar
2 Scott, D.B., Hunter, W.R. and Shichijo, H., IEEE Trans. Electron. Devices ED-29 (1982) 651 Google Scholar
3 Coe, J. and Rhoderick, H., J. Phys. D 9 965 (1976)Google Scholar
4 Lau, S.S., Mayer, J.W., Tu, K.N., J. Appl. Phys. 49 4005 (1978)Google Scholar
5 d'Heurle, F.M., Petrsson, C.S., Baglin, J.E.E., Placa, S.J.La. and Wong, C.Y., J. Appl. Phys. 55 4208 (1984)Google Scholar
6 Sullivan, P., Tung, R.T. and Schrey, F., J. Appl. Phys. 72 478 (1992)Google Scholar
7 Lavoie, C., Cabral, C., d'Heurle, F.M., and Harper, J.M.E., Defect Diffus. Forum 1477 (2001)Google Scholar
8 Lavoie, C., Cabral, C., d'Heurle, F.M., Jordan-Sweet, J.L., Harper, J.M.E., J. Electron. Mater. 31 597 (2002)Google Scholar
9 Tu, K.N., J. Appl. Phys. 48 (1977) 3379 Google Scholar
10 Angilello, J., d'Heurle, F.M., Peterson, S. and egmüller, A.S, J. Vac. Sci. Technol., 17 471 (1980)Google Scholar
11 Gambino, J.P., Colgan, E.G., Materials Chemistry and Physics, pp.99–146, 52 (1998)Google Scholar
12 Rivero, C., Contraintes mécaniques induites par les procédés de la microélectronique: développement des contraintes lors des réactions Co-Si et Ni-Si, Faculté des Sciences et Technique de Saint Jérôme (2005)Google Scholar
13 Zhang, S.L. and d'Heurle, F.M., Thin Solid Films 213, 34 (1992)Google Scholar