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Investigations of Curing Chemistry and Hydrolytic Stability of Polyimide - on - Metal Interfaces

Published online by Cambridge University Press:  15 February 2011

B. H. Cumpston ,
P. V. Nagarkar ,
G. Cornella ,
D. Volfson ,
F. Trusell ,
K. F. Jensen  and
S. D. Senturia
B. H. Cumpston
Affiliation:
Departments of Chemical and Electrical Engineering and Materials Science and Engineering, and the Electronics Packaging Program, Massachusetts Institute of Technology, Cambridge, MA 02139
P. V. Nagarkar
Affiliation:
Departments of Chemical and Electrical Engineering and Materials Science and Engineering, and the Electronics Packaging Program, Massachusetts Institute of Technology, Cambridge, MA 02139
G. Cornella
Affiliation:
Departments of Chemical and Electrical Engineering and Materials Science and Engineering, and the Electronics Packaging Program, Massachusetts Institute of Technology, Cambridge, MA 02139
D. Volfson
Affiliation:
Departments of Chemical and Electrical Engineering and Materials Science and Engineering, and the Electronics Packaging Program, Massachusetts Institute of Technology, Cambridge, MA 02139
F. Trusell
Affiliation:
Departments of Chemical and Electrical Engineering and Materials Science and Engineering, and the Electronics Packaging Program, Massachusetts Institute of Technology, Cambridge, MA 02139
K. F. Jensen
Affiliation:
Departments of Chemical and Electrical Engineering and Materials Science and Engineering, and the Electronics Packaging Program, Massachusetts Institute of Technology, Cambridge, MA 02139
S. D. Senturia
Affiliation:
Departments of Chemical and Electrical Engineering and Materials Science and Engineering, and the Electronics Packaging Program, Massachusetts Institute of Technology, Cambridge, MA 02139
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Abstract

Polyimide-on-metal interfaces relevant to electronics packaging applications have been studied by Fourier transform infrared spectroscopy (FTIR) and X-ray photoelectron spectroscopy (XPS). Two polyimides with different backbone structures were considered: (i) biphenyltetracarboxylic dianhydride (BPDA) - p-phenylene diamine (PDA) and (ii) 4,4′-(hexafluroisopropylidene)-bis(phthalic anhydride) (6FDA) - 4,4′-bis(4-aminophenoxy) biphenyl (APBP). Thin polymer films (10–100 nm) were cured on Al, Cr and Cu surfaces at different temperatures to allow probing of chemical interactions by surface spectroscopies. Anhydride intermediates were detected on all three substrates for both polyimides. Carboxylate intermediates were detected in BPDA-PDA films on Cr and Cu and resulted in increased adhesion at these interfaces. XPS data revealed a nitrogen deficiency at the BPDAPDA/Cr interface. A mechanism explaining the formation of this intermediate and the deficiency of nitrogen is proposed. Hydrolytic stability of the interface was investigated using ex situ total internal reflection FTIR spectroscopy and XPS. The results show that the fluorinated polyimide, 6FDA-APBP, is more stable than BPDA-PDA when treated at 85 °C and 85% relative humidity for 100 hours.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993 , 351
Copyright
Copyright © Materials Research Society 1994

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