Hostname: page-component-586b7cd67f-rcrh6 Total loading time: 0 Render date: 2024-12-02T22:09:49.642Z Has data issue: false hasContentIssue false

Investigation of the deformation behavior in nanoindented metal/nitride multilayers by coupling FIB-TEM and AFM observations

Published online by Cambridge University Press:  01 February 2011

G. Abadias
Affiliation:
Laboratoire de Métallurgie Physique, UMR 6630, Université de Poitiers, SP2MI, Téléport 2, 86962 Chasseneuil-Futuroscope, FRANCE
C. Tromas
Affiliation:
Laboratoire de Métallurgie Physique, UMR 6630, Université de Poitiers, SP2MI, Téléport 2, 86962 Chasseneuil-Futuroscope, FRANCE
Y.Y. Tse
Affiliation:
Laboratoire de Métallurgie Physique, UMR 6630, Université de Poitiers, SP2MI, Téléport 2, 86962 Chasseneuil-Futuroscope, FRANCE
A. Michel
Affiliation:
Laboratoire de Métallurgie Physique, UMR 6630, Université de Poitiers, SP2MI, Téléport 2, 86962 Chasseneuil-Futuroscope, FRANCE
Get access

Abstract

Epitaxial TiN/Cu bilayers and multilayers with periods L between 5 and 50 nm have been grown by ultrahigh vacuum ion beam sputtering on Si and MgO(001) substrates at room temperature. The deformation modes induced by a Berkovich nanoindent have been imaged using Focused Ion Beam – Transmission Electron Microscopy (FIB-TEM) and Atomic Force Microscopy (AFM). The observations suggest that the mechanical response of the multilayers is essentially governed by an extensive plastic flow inside the Cu layers, which is confined by a bending of the more rigid TiN layers. This specific deformation behavior, with no contribution of the interfaces as a barrier for dislocation motion could explain the absence of significant hardness enhancement in this system.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Veprek, S., Veprek-Heijman, M.G.J., Karvankova, P., Prochazka, J., Thin Solid Films 476, 1 (2005)Google Scholar
2 Patscheider, J., MRS Bulletin 28, n°3, 180 (2003)Google Scholar
3 Sproul, W.D., Science 273, 889 (1996)Google Scholar
4 Clemens, B.M., Kung, H., Barnett, S.A., MRS Bulletin 24, n°2, 20 (1999)Google Scholar
5 Barnett, S.A. and Madan, A., Scripta Mater. 50, 739 (2004)Google Scholar
6 Madan, A., Wang, Y, Barnett, S.A, Engstrom, C., Ljungcrantz, H., Hultman, L., Grimsditch, M., J. Appl. Phys. 84, 776 (1998)Google Scholar
7 Chu, X., Wong, M.S., Sproul, W.D., Rohde, S. L., Barnett, S.A., J. Vac. Sci. Technol. A 10, 1604 (1992)Google Scholar
8 Shinn, M., Hultman, L., Barnett, S.A., J. Mater. Res. 7, 901 (1992)Google Scholar
9 Koehler, J.C., Phys. Rev. B 2, 547 (1970)Google Scholar
10 Chu, X. and Barnett, S.A, J. Appl. Phys. 77, 4403 (1995)Google Scholar
11 Kramer, D.E., Foecke, T., Phil. Mag. A 17/18, 3375 (2002)Google Scholar
12 Embury, J.D., Hirth, J.P., Acta. metall. mater. 42, 2051 (1994)Google Scholar
13 Misra, A., Hirth, J.P., Kung, H., Phil. Mag. A 82, 2935 (2002)Google Scholar
14 Hultman, L., Engström, C., Oden, M., Surf. Coat. Technol. 133-134, 227 (2000)Google Scholar
15 Molina-Aldareguia, J.M., Lloyd, S.J., Oden, M., Joelsson, T., Hultman, L., Clegg, W.J., Phil. Mag. A 82, 1983 (2002)Google Scholar
16 Minor, A., Stach, E.A., Morris, J.W., Petrov, I., J. Electron. Mater. 32, 1023 (2003)Google Scholar
17 Kramer, D.E., Savage, M.F., Lin, A., Foecke, T., Scripta Mater. 50, 745 (2004)Google Scholar
18 Ma, L.W., Cairney, J.M., Hoffman, M., Munroe, P.R., Surf. Coat. Technol. 192, 11 (2005)Google Scholar
19 Ljungcrantz, H., Engstrom, C., Hultman, L., Olsson, M., Chu, X., Wong, M.S., Sproul, W.D., J. Vac. Sci. Technol. A 16, 3104 (1998)Google Scholar
20 Tse, Y.Y., Abadias, G., Michel, A., Tromas, C., Jaouen, M., Mat. Res. Soc. Symp. Proc. 778, U6.8., (2003)Google Scholar
21 Abadias, G. and Tse, Y.Y., J. Appl. Phys. 95, 2414 (2004)Google Scholar
22 Oliver, W.C. and Pharr, G.M., J. Mater. Res. 7, 1564 (1992)Google Scholar
23 Abadias, G., Tse, Y.Y., Michel, A., Jaouen, C., Jaouen, M., Thin Solid Films 433, 166 (2003)Google Scholar
24 Ljungcrantz, H., PhD Thesis, Linköping University, Sweden, (1995)Google Scholar
25 McLaughlin, K.K., Stelmashenko, N.A., Lloyd, S.J., Vandeperre, J., Clegg, W.J., Mater. Res. Soc. Symp. Proc. 841, R1.3, (2005)Google Scholar