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Interfacial Reactions Between Sputtered Cr-Sio2 Cermet Thin Film and Polyimide.

Published online by Cambridge University Press:  25 February 2011

Tetsuya Yamazaki
Affiliation:
Production Engineering Research Laboratory, Hitachi Ltd. 292 Yoshida-cho, Totsuka-ku, Yokohama, 244, Japan
Takayoshi Watanabe
Affiliation:
Production Engineering Research Laboratory, Hitachi Ltd. 292 Yoshida-cho, Totsuka-ku, Yokohama, 244, Japan
Kiyoshi Ogata
Affiliation:
Production Engineering Research Laboratory, Hitachi Ltd. 292 Yoshida-cho, Totsuka-ku, Yokohama, 244, Japan
Yasunori Narizuka
Affiliation:
Production Engineering Research Laboratory, Hitachi Ltd. 292 Yoshida-cho, Totsuka-ku, Yokohama, 244, Japan
Takashi Inoue.
Affiliation:
Production Engineering Research Laboratory, Hitachi Ltd. 292 Yoshida-cho, Totsuka-ku, Yokohama, 244, Japan
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Abstract

Interfacial chemical bonding states between polyimides (PI) and sputter coated Cr-SiO2 thin film have been investigated mainly by XPS to obtain a reliability basis for thin film resistor application of Cr-SiO2.We tried to leave different level of etch residue by applying two etchants of different etching power, then analyzed the etched surfaces by XPS, TEM and EXAFS. It proved that at first Cr in the sputtered Cr-SiO2 reacts with oxygen atoms which were introduced during O2 plasma treatment of the PI surface and also with original carbonyl oxygen of the PI to offer Cr-O-C bond at the Cr-SiO2/PI interface. This was concluded from the attenuation of Cls peak intensity corresponding to the carbonyl group. Then after thermal annealing, Cr extracted most of the interface oxygen to give a Cr2O3 layer of a discrete thickness. These phenomena were supported by TEM and SR-EXAFS as well.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

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References

REFERENCES

1 Matino, H., Ushiroda, T., IBM J.Res.Develop. 1977, (November), 576 CrossRefGoogle Scholar
2 Inoue, T. et al. , IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(1), 7 (1992)CrossRefGoogle Scholar
3 Narizuka, Y. et al., Inst.Electr.Info.comm.engineers, Spring meeting Japan 1989, 5150 Google Scholar
4 Ogata, K. et al. , Mat.Res.Soc.Symp.Proc. 238, 593 (1992)CrossRefGoogle Scholar
5 Katnani, A.D. et al., J.Adhesion Sci.Technol. 3, (6) 441 (1989)CrossRefGoogle Scholar
6 Chou, N.J. et al. , J.Electrochem.Soc. 131, (10) 2335 (1984)CrossRefGoogle Scholar
7 Chou, N.J., Tang, C.H., J.Vac.Sci.Technol. A2, (2) 751 (1984)CrossRefGoogle Scholar
8 Hamrin, K. et al. , J Phys.Chem.Solids 30, 1835 (1969)Google Scholar