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Interdiffusion and Grain-Boundary Migration in Au/Cu Bilayers During Ion-Irradiation

Published online by Cambridge University Press:  28 February 2011

Dale E. Alexander ,
L. E. Rehn  and
Peter M. Baldo
Dale E. Alexander
Affiliation:
Materials Science Division, Argonne National Laboratory, Argonne, IL 60439
L. E. Rehn
Affiliation:
Materials Science Division, Argonne National Laboratory, Argonne, IL 60439
Peter M. Baldo
Affiliation:
Materials Science Division, Argonne National Laboratory, Argonne, IL 60439
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Abstract

Ion irradiation and annealing experiments have been conducted on Au/Cu bilayer films to evaluate the effect of irradiation on diffusion-induced grain boundary migration (DIGM). The Au films were prepared with a large-grained microstructure with grain boundaries perpendicular to the film surface and extending through the film thickness. Irradiations were conducted with 1.5 MeV Kr at 228°C. Rutherford backscattering spectrometry of the samples revealed that interdiffusion was substantially enhanced in the irradiated area relative to the unirradiated area. Both irradiated and annealed-only areas were characterized by a nearly uniform composition of 14 at.% and 7 at.% Cu respectively through the entire thickness of the underlying Au film. Small probe X-ray energy dispersive spectroscopy showed significant lateral compositional homogeneities in both irradiated and annealed areas. These two results are consistent with previous observations of DIGM in the Au/Cu system, suggesting that this previously unexamined interdiffusion mechanism contributes to ion beam mixing.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 235: Symposium A – Phase Formation and Modification by Beam-Solid Interactions , 1991 , 559
Copyright
Copyright © Materials Research Society 1992

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References

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