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Integration Challenges for Chemical Mechanical Polishing of Cu/Low-κ Interconnects

Published online by Cambridge University Press:  01 February 2011

Jeffrey A. Lee ,
Mansour Moinpour ,
Huey-Chiang Liou  and
Thomas Abell
Jeffrey A. Lee
Affiliation:
Intel Researcher at MIRAI, Tsukuba, Japan
Mansour Moinpour
Affiliation:
Intel Corp., Santa Clara
Huey-Chiang Liou
Affiliation:
Intel Corp., Santa Clara
Thomas Abell
Affiliation:
Intel Researcher at IMEC, Leuven, Belgium
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Abstract

The drive for improved performance of microelectronic devices has led to the prevalence of copper metallization and the aggressive development of low-permittivity (low-κ) dielectric materials for use as interlayer dielectrics in BEOL interconnect structures. Progressive scaling of metal line widths coupled with the need to incorporate ultra low-κ (ULK) dielectrics, with κ<2.2, presents numerous challenges for integration and reliability. Perhaps the most significant challenge for the 90nm technology node and beyond is successful planarization of Cuinterconnect structures by chemical mechanical polishing (CMP). The present paper will discuss the general integration challenges and key structural reliability issues for chemical mechanical polishing of Cu-interconnects incorporating ULK dielectric materials.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 767: Symposium F – Chemical-Mechanical Planarization , 2003 , F7.4
Copyright
Copyright © Materials Research Society 2003

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References

1.International Technology Roadmap of Semiconductors; ITRS Home Page, http://public.itrs.net/Files/2001ITRS/Home.htmGoogle Scholar
2. Moinpour, M. Tregub, A. Oehler, A. and Cadien, K. MRS Bulletin, October (2002), pp 766–771 Google Scholar
3. Singh, R.K. Lee, S. Choi, K. Basim, G. Choi, W. Chen, Z. and Moudgil, B.M. MRS Bulletin, October (2002)Google Scholar
4. Tregub, A. and Moinpour, M. AVS 3rd Int. Conf. On Microelectronics and Interfaces, Santa Clara, Ca (February), 2002 Google Scholar
5. Singer, P. Semiconductor International, (2000)Google Scholar
6. Nguyen, J. Marten, G. Carpio, R. Grief, M. and Joshi, S. Mat. Res. Soc. Symp. Proc. Vol. 732E, (2002) pp I1.4.1–8 Google Scholar
7. Lee, J.A. Wetzel, J.T. Noakes, A. Buchanan, K. McNeil, J. and Beekmann, K, AVS Microelectronics Conference, (February), Santa Clara, 2002 Google Scholar
8. Small, R. Carter, M. and Pete, M. Advancing Applications in Contamination Control, January (2001)Google Scholar
9. Block, Kelly H. and Rayle, Heather L. Semiconductor International, (2002)Google Scholar
10. Bajaj, R. Zutshi, A. Surana, R. Naik, M. and Pan, T. MRS Bulletin, October 2002, pp776–78Google Scholar
11. Miller, A. Fischer, P.B. Feller, A., Cadien, K. IEEE (2001)Google Scholar
12. Moinpour, M. and Liou, Huey-chiang, un-published data.Google Scholar
13. Havemann, R. H. and Hutchby, James A. Proceedings of the IEEE, Vol 89, NO. 5, May 2001 Google Scholar
14. Kloster, G. Scherban, T. Xu, G. Blaine, J. Sun, B. and Zhou, Y. IITC Proceedings, p. (2002)Google Scholar
15. Lin, S. IITC Proceedings, (2000)Google Scholar
16. Lee, J. Wetzel, J. T., Ho, P.S. and Merrill, C., Spring MRS 2002, April, San Francisco, CA, (2002)Google Scholar
17. Ahlburn, B.T, Gallagher, M. Gronbeck, D. Prokopowicz, G. Sullivan, C. Gidley, D. Kastenmeier, B., and Lee, J.A. Advanced Metallization Conference, (October), San Diego, (2002)Google Scholar
18. Iacopi, A F., Patz, M. Vos, I. Tokei, Zs. Sijmus, B. Le, Q.T. Sleeckx, E. Eyckens, B. Struyf, H., Maex, K. Materials for Advanced Metallization Conference 2003 Google Scholar
19. Tsai, S. Chen, L. Sun, L. R.Mavliev, Hsu, W. Xia, L. and Morad, R., IITC Proceedings (2002)Google Scholar
20. Evans, D. MRS Proceedings, Vol 732E (2002)Google Scholar
21. Hanzono, M. Amanokura, J. and Kamigata, Y. MRS Bulletin, October (2002) pp 772–75Google Scholar
22. Fury, M. Levert, J. Mukherjee, S. and DeBear, D. ECS Hawaii Proceedings, October (1999).Google Scholar