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In-situ study of the stiffness of alumina thin films during vapor deposition

Published online by Cambridge University Press:  21 March 2011

Joris Proost  and
Frans Spaepen
Joris Proost
Affiliation:
Division of Engineering and Applied Sciences, Harvard University, Cambridge, MA 02138, USA
Frans Spaepen
Affiliation:
Division of Engineering and Applied Sciences, Harvard University, Cambridge, MA 02138, USA
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Abstract

The evolution of the biaxial modulus of amorphous alumina thin films has been studied insitu during electron-beam evaporation at 400°C on Si and sapphire substrates. A constant value of 197 ± 30 GPa was measured up to a thickness of 1.17 μm when depositing at 3 Å/s. This value was identical to that of films thinner than 0.30 μm deposited at an average rate of 6 Å/s. Above 0.30 μm, the modulus in these films decreased continuously to a value of 50 ± 8 GPa at a final thickness of 2.05 μm. Based on their refractive indices, the films deposited at 6 Å/s are 30% less dense than those deposited at 3 Å/s. This density deficit is insufficient to account for the modulus decrease; the remainder is probably the result of slit-like microcracks.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 672: Symposium O – Mechanisms of Surface and Microstructure Evolution in Deposited Films and Film Structures , 2001 , O9.9
Copyright
Copyright © Materials Research Society 2001

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References

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