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Inkjet Printing of Biomedical Adhesives

Published online by Cambridge University Press:  01 February 2011

Anand Doraiswamy
Affiliation:
[email protected], University of North Carolina, Biomedical Engineering, 152 MacNider Hall, CB 57575, Chapel Hill, NC, 27599-7575, United States
Jan Sumerel
Affiliation:
[email protected], Fujifilm Dimatix, 2230 Martin Avenue, Santa Clara, CA, 95050, United States
Jonathan Wilker
Affiliation:
[email protected], Purdue University, West Lafayette, IN, 47907-2084, United States
Roger J Narayan
Affiliation:
[email protected], University of North Carolina, Chapel Hill, NC, 27599-7575, United States
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Abstract

Synthetic adhesives have largely displaced natural adhesives in the automotive, aerospace, biomedical, electronic, and marine equipment industries over the past century. We have demonstrated the thin film deposition of biological adhesives using piezoelectric inkjet technology. A MEMS based piezoelectric actuator was controlled to jet uniform fluid flow of the adhesive solution through the ink jet nozzles. Microscopic deposition of adhesives enables improved bonding for a range of advanced electronic and biomedical applications. By printing such small and spatially aligned drops, bond lines between materials are reduced, ultimately resulting in increased bond strength and structural integrity. Piezoelectric ink jet deposition of biological adhesives may greatly improve wound repair in next generation eye repair, fracture fixation, organ fixation, and wound closure.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

1. Kampfhoefner, F.J., IEEE Trans. Elec. Dev. ED–19 (1972) 584.Google Scholar
2. Kuhn, L., Myers, A., Sci. Am. 240 (1979) 162.Google Scholar
3. Wilson, W.C., Boland, T., Anat. Rec. Part A 272 (2003) 491.Google Scholar
4. Mironov, V., Boland, T., Trusk, T., Forgacs, G., Markwald, R.R., Trends Biotechnol. 21 (4) (2003) 157.Google Scholar
5. Barron, J.A., Spargo, B.J., Ringeisen, B.R., Appl. Phys. A 79 (2004) 1027.Google Scholar
6. Calvert, P., Chem. Mater. 13 (2001) 3299.Google Scholar
7. Brünahl, J., Grishij, A.M., Sens. Act. A 101 (2002) 371.Google Scholar