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Influence of Substrate on Cracking of Vapour-Deposited Thin Films Due to Residual Stresses

Published online by Cambridge University Press:  22 February 2011

Robert M. Fisher  and
J.Z. Duan
Robert M. Fisher
Affiliation:
Center for Advanced Materials, Materials and Chemical Sciences Division Lawrence Berkeley Laboratory, 1 Cyclotron Rd., Berkeley, CA 94720
J.Z. Duan
Affiliation:
Center for Advanced Materials, Materials and Chemical Sciences Division Lawrence Berkeley Laboratory, 1 Cyclotron Rd., Berkeley, CA 94720
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Abstract

The influence of the substrate material on the column and grain microstructure, the residual stresses, crack patterns and delamination of Cr films has been investigated using TEM, SEM, and X-ray diffraction. The inter-influence of these factors which determine the long term reliability of microelectronics is discussed. When interfacial adhesion is very low, as may be the case with some polymer substrates, cracking occurs discontinuously during film formation each time the stress exceeds the critical value for fracture.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 153: Symposium J – Interfaces Between Polymers, Metals, and Ceramics , 1989 , 299
Copyright
Copyright © Materials Research Society 1989

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References

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