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Indentation Fracture Studies of a BaTiO3 Thin Film on a Silicon Substrate

Published online by Cambridge University Press:  15 February 2011

Wai-Ming Ho ,
Ran Fu ,
Kai-Tak Wan ,
Ji Chou  and
Tong-Yi Zhang
Wai-Ming Ho
Affiliation:
Department of Mechanical Engineering, Center for Advanced Engineering Materials
Ran Fu
Affiliation:
Department of Mechanical Engineering, Center for Advanced Engineering Materials
Kai-Tak Wan
Affiliation:
Department of Mechanical Engineering, Center for Advanced Engineering Materials
Ji Chou
Affiliation:
Department of Physics, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong.
Tong-Yi Zhang
Affiliation:
Department of Mechanical Engineering, Center for Advanced Engineering Materials
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Abstract

It has been experimentally and theoretically found that the critical applied stress intensity factor for indentation cracking also depends linearly on the reciprocal of the square root of crack length when the indentation fracture technique is used to measure residual stresses in thin films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 403: Symposium I – Polycrystalline Thin Films: Structure, Texture, Properties and Applications II , 1995 , 241
Copyright
Copyright © Materials Research Society 1996

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References

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