Hostname: page-component-745bb68f8f-b6zl4 Total loading time: 0 Render date: 2025-01-27T02:55:27.341Z Has data issue: false hasContentIssue false
  • English
  • Français

Hinge Sensitivity in a Micro-Rotating Structure for predicting Induced Thermo Mechanical Stress in Integrated Circuit Metal Interconnects

Published online by Cambridge University Press:  01 February 2011

J. M. M. dos Santos ,
K. Wang ,
S. M. Soare ,
S. J. Bull ,
A. B. Horsfall ,
N. G. Wright ,
A. G. O'Neill ,
J. G. Terry ,
A. J. Walton  and
A. M. Gundlach
...Show all authors
J. M. M. dos Santos
Affiliation:
School of Electrical, Electronic and Computer Engineering, Merz Court, University of Newcastle, Newcastle, NE1 7RU, UK; [email protected]
K. Wang
Affiliation:
School of Electrical, Electronic and Computer Engineering, Merz Court, University of Newcastle, Newcastle, NE1 7RU, UK; [email protected]
S. M. Soare
Affiliation:
School of Chemical Engineering and Advanced Materials, Herschel Building, University of Newcastle, Newcastle, NE1 7RU, UK
S. J. Bull
Affiliation:
School of Chemical Engineering and Advanced Materials, Herschel Building, University of Newcastle, Newcastle, NE1 7RU, UK
A. B. Horsfall
Affiliation:
School of Electrical, Electronic and Computer Engineering, Merz Court, University of Newcastle, Newcastle, NE1 7RU, UK; [email protected]
N. G. Wright
Affiliation:
School of Electrical, Electronic and Computer Engineering, Merz Court, University of Newcastle, Newcastle, NE1 7RU, UK; [email protected]
A. G. O'Neill
Affiliation:
School of Electrical, Electronic and Computer Engineering, Merz Court, University of Newcastle, Newcastle, NE1 7RU, UK; [email protected]
J. G. Terry
Affiliation:
Scottish Microelectronics Centre, Kings Buildings, University of Edinburgh, EH9 3JL, UK
A. J. Walton
Affiliation:
Scottish Microelectronics Centre, Kings Buildings, University of Edinburgh, EH9 3JL, UK
A. M. Gundlach
Affiliation:
Scottish Microelectronics Centre, Kings Buildings, University of Edinburgh, EH9 3JL, UK
J. T. M. Stevenson
Affiliation:
Scottish Microelectronics Centre, Kings Buildings, University of Edinburgh, EH9 3JL, UK
Get access

Abstract

The process-induced stress in interconnects within integrated circuits (IC) has a direct influence on the mean time to failure of the devices. Since measurement of stress in individual metallised lines is not possible by existing techniques, another approach has been adopted where a test structure is generated during fabrication based on a micro-rotating cantilever sensor. To support the design, finite element modeling (FEM) has been performed. By comparing the rotation predicted by FEM simulations and that observed experimentally, a clear discrepancy is observed which is critically dependent on the details of the sensor design, the pattern transfer of the lithographic process and on the dry etching processing.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 795: Symposium U – Thin Films - Stresses and Mechanical Properties X , 2003 , U10.10
Copyright
Copyright © Materials Research Society 2004

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Korhonen, MA, Paszkiet, CA, LiChe-Yu, , J. Appl. Phys., 69(12), 8083–8091, (1991).Google Scholar
2. Terry, J.G., Walton, A.J., Gundlach, A.M., Stevenson, J.T.M., Horsfall, A.B., Wang, K., dos Santos, J.M.M., Soare, S.M., Wright, N.G., O'Neill, A.G., Bull, S.J., accepted for presentation at the International Conference on Microelectronic Test Structures ICMTS, Hyogo, Japan (2004).Google Scholar
3. Horsfall, A.B., dos Santos, J.M.M., Soare, S.M., Wright, N.G., O'Neill, A.G., Bull, S.J., Walton, A.J., Gundlach, A.M., Stevenson, J.T.M., published in proceedings of ESSDERC Conference, pp 115–118, Estoril, Portugal (2003).Google Scholar
4. Horsfall, A.B., dos Santos, J.M.M., Soare, S.M., Wright, N.G., O'Neill, A.G., Bull, S.J., Walton, A.J., Gundlach, A.M., Stevenson, J.T.M., Microelectronics Reliability, 43, 1797–1801 (2003).Google Scholar
5. Horsfall, A.B., dos Santos, J.M.M., Soare, S.M., Wright, N.G., O'Neill, A.G., Bull, S.J., Walton, A.J., Gundlach, A.M., Semiconductor Science and Technology, 18, 992 (2003).Google Scholar
6. Horsfall, A.B., Wang, K., dos Santos, J.M.M., Soare, S.M., Bull, S.J., Wright, N.G., O'Neill, A.G., Terry, J.G., Walton, A.J., Gundlach, A.M., Stevenson, J.T.M., submitted to the IEEE Transactions on Device and Material Reliability (2003).Google Scholar
7. dos Santos, J.M.M., Wright, N.G., Horsfall, A.B., Soare, S.M., O'Neill, A.G., Bull, S.J., Walton, A.J., Gundlach, A.M., Stevenson, J.T.M., published in the proceedings of EUROSENSORS XVII Conference, pp. 965–968, Guimarães, Portugal (2003).Google Scholar
8. dos Santos, J.M.M., Horsfall, A.B., Wright, N.G., Soare, S.M., Bull, S.J., Wang, K., O'Neill, A.G., Terry, J.G., Walton, A.J., Gundlach, A.M., submitted to the Sensors and Actuators A (2003).Google Scholar
9. Lee, S.H., Kwon, D., Thin Solid Films, 341, p136 (1999).Google Scholar
10. Soare, S.M., Bull, S.J., O'Neill, A.G., Wright, N.G., Horsfall, A.B., dos Santos, J.M.M., Surface and Coatings Technology, (2003) (in press).Google Scholar
11. Soare, S., Bull, S. J., Horsfall, A., dos Santos, J., O'Neill, A.G. and Wright, N.G., Mat. Res. Soc. Symp. Proc., 750, 83–88 (2003).Google Scholar