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High-throughput top-down and bottom-up processes for forming single-nanotube based architectures for 3D electronics

Published online by Cambridge University Press:  31 January 2011

Anupama B Kaul ,
Krikor G. Megerian ,
Paul von Allmen ,
Robert Kowalczyk  and
Richard Baron
Anupama B Kaul
Affiliation:
[email protected][email protected], California Institute of Technology, Jet Propulsion Labs, Pasadena, California, United States
Krikor G. Megerian
Affiliation:
[email protected], Jet Propulsion Labs, California Institute of Technology, Pasadena, California, United States
Paul von Allmen
Affiliation:
[email protected], Jet Propulsion Labs, California Institute of Technology, Pasadena, California, United States
Robert Kowalczyk
Affiliation:
[email protected], Jet Propulsion Labs, California Institute of Technology, Pasadena, California, United States
Richard Baron
Affiliation:
[email protected], California Institute of Technology, Jet Propulsion Labs, Pasadena, California, United States
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Abstract

We have developed manufacturable approaches to form single, vertically aligned carbon nanotubes, where the tubes are centered precisely, and placed within a few hundred nm of 1-1.5 m deep trenches. These wafer-scale approaches were enabled by chemically amplified resists and inductively coupled Cryo-etchers for forming the 3D nanoscale architectures. The tube growth was performed using dc plasma-enhanced chemical vapor deposition (PECVD), and the materials used for the pre-fabricated 3D architectures were chemically and structurally compatible with the high temperature (700 C) PECVD synthesis of our tubes, in an ammonia and acetylene ambient. Tube characteristics were also engineered to some extent, by adjusting growth parameters, such as Ni catalyst thickness, pressure and plasma power during growth. Such scalable, high throughput top-down fabrication techniques, combined with bottom-up tube synthesis, should accelerate the development of PECVD tubes for applications such as interconnects, nano-electromechanical (NEMS), sensors or 3D electronics in general.

Keywords

electronic materialchemical vapor deposition (CVD) (deposition)microelectro-mechanical (MEMS)
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1179: Symposium BB – Material Systems and Processes for Three-Dimentional Micro-and Nanoscale Fabrication and Lithography , 2009 , 1179-BB06-24
Copyright
Copyright © Materials Research Society 2009

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References

REFERENCES

1 Li, J. Ye, Q. Cassell, A. Ng, H. T. Stevens, R. Han, J. and Meyyappan, M. Appl. Phys Lett. 82, 2491(2003).Google Scholar
2 Bachtold, A. Hadley, P. Nakanishi, T. and Dekker, C. Science 294, 1317(2001).Google Scholar
3 Yu, C. Saha, S. Zhou, J. Shi, L. Cassel, A. Cruden, B. A. Ngo, Q. and Li, J. Transactions of the ASME 128, 234(2006).Google Scholar
4 Ren, Z. F. Huang, Z. P. Xu, J. W. Wang, J. H. Bush, P. Siegal, M. P. and Provencio, P. N. Science 282, 1105(1998).Google Scholar
5 Nolan, D. Lynch, D. C. and Cutler, A. H. J. Phys. Chem. B 102, 4165(1998).Google Scholar
6 Teo, K. B. K. Lee, S.B. Chhowalla, M. Semet, V. Binh, V. T. Groening, O. Castignolles, M. Loiseau, A. Pirio, G. Legagneux, P. Pribat, D. Hasko, D. G. Ahmed, H. Amaratunga, G. A. J. and Milne, W. I. Nanotech. 14, 204(2003).Google Scholar
7 Kaul, A. B. Megerian, K. Allmen, P. von, and Baron, R. L. Nanotech. 20, 075303(2009).Google Scholar
8 Laermer, F. and Schilp, D. “Method of anisotropic ally etching silicon,” U.S. Patent 5 501 893.Google Scholar
9 Tsujimoto, Tachi, K. and Okudaira, S. Appl. Phys. Lett. 52, 616(1988).Google Scholar
10 Helveg, S. Lopez-Cartes, C., Sehested, J. Hansen, P. Clausen, B. Rostrup-Nielson, J., Abild-Pedersen, F. and Norskov, J. Nature 427, 426(2004).Google Scholar